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Luobin Zhang

ORCID: 0000-0002-8291-7095
Observed ORCID: 0000-0002-8291-7095
OpenAlex ID: A5091333703
A short review on laser welding/brazing of aluminum alloy to steel
2021 · Jintao Wang, Xing Fu, et al. · The International Journal of Advanced Manufacturing Technology · 49
Brief Review of Nanosilver Sintering: Manufacturing and Reliability
2021 · Jintao Wang, Si Chen, et al. · Journal of Electronic Materials · 39
Effect of SrO content on microstructure of Bi2O3-B2O3-ZnO-BaO-SrO low-melting glass frit and joining performance of sodalime glass substrates
2021 · Luobin Zhang, Qin Sun, et al. · Journal of Alloys and Compounds · 34
An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
2024 · Yini Chen, Jintao Wang, et al. · Journal of Materials Research and Technology · 26
The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold
2021 · Weiwei Zhang, Jiahao Liu, et al. · International Journal of Adhesion and Adhesives · 26
Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
2022 · Weiwei Zhang, Jintao Wang, et al. · International Journal of Adhesion and Adhesives · 22
Effect of melt hydrogenation on microstructure evolution and tensile properties of (TiB + TiC)/Ti-6Al-4V composites
2020 · Liang Wang, Luobin Zhang, et al. · Journal of Materials Research and Technology · 16
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Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives
2022 · Weiwei Zhang, Jiahao Liu, et al. · ACS Applied Electronic Materials · 12
Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
2023 · Jianqiang Wang, Fangcheng Duan, et al. · Journal of Materials Science Materials in Electronics · 9
CoSn3 Intermetallic Nanoparticles for Electronic Packaging
2022 · Jintao Wang, Ziwen Lv, et al. · Nanomaterials · 7
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Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging
2023 · Jintao Wang, Jintao Wang, et al. · Scientific Reports · 4
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Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag
2022 · Jintao Wang, Luobin Zhang, et al. · Journal of Materials Science · 4
A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
2022 · Jintao Wang, Xinjie Wang, et al. · Materials · 3
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A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy
2024 · Jianqiang Wang, Jianqiang Wang, et al. · Nanomaterials · 2
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Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM
2023 · Jintao Wang, Jintao Wang, et al. · ACS Omega · 2
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Preparation of silver-coated copper powders and its application in conductive adhesives
2022 · Weiwei Zhang, Hongtao Chen, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Rapid realization of ultra-high vacuum packaging of atomic chips by thick film technology
2023 · Luobin Zhang, Jintao Wang, et al. · Vacuum · 1
Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging
2023 · Fupeng Huo, Ye Wang, et al. · International Conference on Electronics Packaging (ICEP)
Works count: 18
Citation count: 258
H-index: 9
I10-index: 8
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