Author

Chien-Ming Chen

Institutions: Micron (United States), Advanced Semiconductor Engineering (Taiwan), Micron (Taiwan)

Observed institutions: Micron (United States), Advanced Semiconductor Engineering (Taiwan), Micron (Taiwan)

ORCID: 0000-0003-0876-5705

Observed ORCID: 0000-0003-0876-5705

OpenAlex ID: A5091358610

Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application

2024 · Vance Liu, Yung-Sheng Zou, et al. · Materials Science in Semiconductor Processing · 24

Study of robust package strength characterization of memory packages for handheld application

2022 · Vance Liu, Chien-Ming Chen, et al. · Memories - Materials Devices Circuits and Systems · 6

Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package

2023 · Vance Liu, Koustav Sinha, et al. · Journal of Materials Science Materials in Electronics · 5

Study of solder joint reliability performance and component shear Property of hybrid low temperature solder joints

2025 · Vance Liu, Yan-Sen Liao, et al. · Materials Science in Semiconductor Processing · 4

Strength characterization of ultrathin chips by using large deflection theory of multi-layer plate for three-point bending tests

2024 · Dao-Long Chen, Chien-Ming Chen, et al. · Extreme Mechanics Letters · 3

Thermomechanical, mechanical, and physical characterization study of epoxy molding compound of memory packages under high-temperature aging

2026 · Vance Liu, Yun-Ying Chen, et al. · Journal of Materials Science Materials in Electronics · 1

Nonlinear bending analysis of ultrathin bilayer chips in four-point bending tests considering friction and large deflection

2026 · Dao-Long Chen, Yi-Shen Li, et al. · Microelectronics Reliability

Works count: 7

Citation count: 43

H-index: 4

I10-index: 1