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Author

Dileep Karnam

Observed institution: National Cheng Kung University
ORCID: 0009-0008-1261-5156
Observed ORCID: 0009-0008-1261-5156
OpenAlex ID: A5092250797
Simulation study and parameter optimization of laser TSV using artificial neural networks
2023 · Dileep Karnam, Yu-Lung Lo, et al. · Journal of Materials Research and Technology · 22
A complete phase distribution map of the laser affected zone and ablation debris formed by nanosecond laser-cutting of SiC
2025 · Mehdi Rouhani, Sai Bhavani Sravan Metla, et al. · Journal of Materials Processing Technology · 17
Novel approach to nanosecond laser drilling of a crack-free through hole on SiC wafer
2025 · Luis Bustamante, Dileep Karnam, et al. · Journal of Materials Research and Technology · 13
Plasma mediated ns-laser erosion of SiC monitored using Raman spectroscopy and in-operando LIBS
2024 · Dileep Karnam, Mehdi Rouhani, et al. · Surfaces and Interfaces · 13
Spray mist-assisted drilling of through silicon vias (TSV) using nanosecond laser: Influence of CNT nanofluid
2024 · Dileep Karnam, Yu-Lung Lo, et al. · Journal of Materials Research and Technology · 5
Optimized Nanosecond Laser Cutting of SiC Wafers: A Simulation‐Driven Approach
2025 · Dileep Karnam, Yu‐Lung Lo · Advanced Materials Technologies · 2
Optimized Nanosecond Laser Cutting of SiC Wafers: A Simulation‐Driven Approach (Adv. Mater. Technol. 14/2025)
2025 · Dileep Karnam, Yu‐Lung Lo · Advanced Materials Technologies · 1
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Simulation and experimental investigations of damage evolution in SiC during nanosecond laser cutting
2026 · Dileep Karnam, Yu-Lung Lo, et al. · Applied Surface Science
Novel Approach to Nanosecond Laser Drilling of a Crack-Free Hole on Sic Wafer
2024 · Luis Bustamante, Dileep Karnam, et al. · SSRN Electronic Journal
Works count: 9
Citation count: 72
H-index: 5
I10-index: 4
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