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Ilya A. Solovyov

Observed names: I. A. Solovyov, I.A. Solovyov, Ilya Solovyov, И.А Соловьев, И.А. Соловьев, Соловьев, Илья Андреевич
ORCID: 0000-0001-5673-0684
Observed ORCID: 0000-0001-5673-0684
OpenAlex ID: A5092921216
Problems of Microsystems Reliability Design with Redistribution Layers in Wafer Level Packaging
2024 · Mikhail D. Kochergin, Ilya A. Solovyov, et al. · International Siberian workshops and tutorials on electron devices and materials · 2
Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging
2023 · Sergey Evstafyev, Denis Vertyanov, et al. · International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) · 2
Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
2025 · Igor A. Belyakov, Mikhail D. Kochergin, et al. · Modern Electronic Materials · 1
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Research and Analysis of Thermomechanical Stresses in the Structure of a Wafer with Embedded ICs with Consideration of Temperature Effects in Manufacturing Process Route
2023 · S. S. Evstafyev, I. A. Solovyov, et al. · Russian Microelectronics · 1
Simulation of Intermetallic Phase Formation at the Solder Bump/UBM Interface in Flip-Chip Interconnections
2026 · Svetlana I. Gladkova, Ilya A. Solovyov, et al. · International Siberian workshops and tutorials on electron devices and materials
Organometallic Pyrolysis Approach for CopperBased Composite Formation in Redistribution Layers
2026 · Mikhail D. Kochergin, Ilya A. Solovyov, et al. · Ural Symposium on Biomedical Engineering, Radioelectronics and Information Technology (USBEREIT)
Design and Analysis of a Stacked Silicon Wafer-Based Technology for Multilayer Multi-Chip Modules
2026 · Ilya A. Solovyov, Andrey Yu. Titov, et al.
Modeling of Intermetallic Phase Formation Processes at the Border of a Contact Pad With Ubm and a Solder Bump
2025 · S.I. Gladkova, D.V. Vertyanov, et al. · All-Russian Youth Scientific Conference
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Технология Производства Многоуровневых Микросистем С Торцевой Коммутацией На Основе Органических Подложек И Бескорпусных Микросхем
2025 · Д.В. Вертянов, И.А. Беляков, et al. · Nanoindustry Russia
Анализ дефектов микросварного соединения золото-алюминий в корпусах микросхем
2023 · В.Д Дротенко, И.А Соловьев, et al. · ТЕНДЕНЦИИ РАЗВИТИЯ НАУКИ И ОБРАЗОВАНИЯ
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Analysis of Designs of 3d Microcircuits With End-type Switching
2022 · Жумагали, Райымбек Нуржанулы, Вертянов, Денис Васильевич, et al.
Works count: 11
Citation count: 6
H-index: 2
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