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Dongping ZHAN

Observed name: Dongping Zhan
ORCID: 0000-0003-2903-6683
Observed ORCID: 0000-0003-2903-6683
OpenAlex ID: A5093020102
Dominant factors study on roughness and material removal rate in electrochemical mechanical polishing of tungsten carbide surface
2026 · Weibin Tang, Xiangbo He, et al. · The International Journal of Advanced Manufacturing Technology · 4
Bridge SECM and SECCM with a Coaxial Microelectrode@Micropipette Probe
2026 · Lu Liu, Hongyu Chen, et al. · Analytical Chemistry · 2
Unveiling the volcano relationship between adsorption ability of tetrazolium levelers and their microvia filling performance in acidic copper electroplating bath
2026 · Jia-Qiang Yang, Yi Zhao, et al. · Electrochimica Acta · 2
Investigation on localized anodic etching of gallium nitride by scanning electrochemical probe lithography
2026 · Yiqing Huang, Wentao Chen, et al. · Electrochimica Acta · 1
From micro-scale imaging to mechanistic insight: The role of scanning electrochemical microscopy in deciphering electrochemical interface reactions
2026 · Heng Yang, Nianning Zhao, et al. · Current Opinion in Electrochemistry · 1
Study on a non-contact polishing method using motion coupling confined etchant layer technique
2017 · Yongzhi Cao, Yuchao Jia, et al. · International Journal of Nanomanufacturing · 1
Dynamic Support Characteristics of a Conical Hydrostatic Bearing Spindle and Their Effects on Surface Formation in Precision Grinding
2026 · Ruirui Li, Jiapeng Zhan, et al. · Lubricants
Complexation Mechanism of a Novel Alkaline Cu(I) Electroplating System Investigated by UV–Visible Spectroscopy
2026 · Lixin Yu, Yuqing Feng, et al. · Analytical Chemistry
Latest and Hot Papers
2018 · Dongping ZHAN · Journal of Electrochemistry
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Works count: 9
Citation count: 11
H-index: 2
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