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Awwal A. Adesunkanmi
Observed name:
Awwal Adeniyi Adesunkanmi
Institution:
Leibniz Institute for High Performance Microelectronics
Observed institution:
Leibniz Institute for High Performance Microelectronics
ORCID:
0009-0003-8489-627X
Observed ORCID:
0009-0003-8489-627X
OpenAlex ID:
A5093222834
The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps
2024
·
Zhibo Cao
, Jens Lehmann
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
2
Reliable Backside IC Preparation Down to STI Level Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry
2023
·
Norbert Herfurth
, Awwal A. Adesunkanmi
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
2
Novel Backside IC Preparation Stopping on STI with Full Circuit Functionality Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry
2024
·
Norbert Herfurth
, Awwal A. Adesunkanmi
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
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Works count:
3
Citation count:
4
H-index:
2
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