Author

Saeid Nahri

Observed name: saeid nahri

Institution: Sahand University of Technology

Observed institution: Sahand University of Technology

ORCID: 0009-0005-5399-8497

Observed ORCID: 0009-0005-5399-8497

OpenAlex ID: A5093355834

Microstructural evolution during low-temperature TLP bonding of WC-6Co cemented carbide to AISI 1045 steel using multi-layer of Ni/Cu/In/Cu/Ni

2024 · Saeid Nahri, Reza Tavangar · Welding in the World · 3

TLP Bonding of WC-6Co to 1045 Steel Using Multi-Interlayer of Ni/Cu/Sn/Cu/Ni

2024 · Saeid Nahri, Ahad Samadi · Metallurgical and Materials Transactions B · 2

Microstructural evolution during low-temperature TLP bonding of Inconel 600 to copper for high-temperature service applications

2025 · Saeid Nahri · Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications · 1

Transient Liquid Phase Bonding of Copper and AISI 304 L Using Tin and Indium Interlayers for High-Temperature Service Applications

2025 · Saeid Nahri · Journal of Materials Engineering and Performance

Tlp Bonding of Wc-6co to Ni/Cu Coated 1045 Steel Using Tin as Interlayer: Studying the Effect of Bonding Time and Thickness of Copper Coated Interlayer on Microstructure and Mechanical Properties of Joints

2023 · saeid nahri, ahad samadi · SSRN Electronic Journal

Works count: 5

Citation count: 6

H-index: 2

I10-index: