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Sima Besharat Ferdowsi
Institution:
Lamar University
Observed institution:
Lamar University
ORCID:
0009-0008-3783-1939
Observed ORCID:
0009-0008-3783-1939
OpenAlex ID:
A5094246295
Comparison of the Reliability of SAC305 and Innolot-Based Solder Alloy in a Board-Level BGA Package Considering Harmonic and Random Vibration Environment
2025
·
Sima Besharat Ferdowsi
, Sushil Doranga
, et al.
·
Electronics
·
11
PDF
A novel approach of fatigue testing and evaluation of electronic systems based on phase tracking
2024
·
Sushil Doranga
, Sima Besharat Ferdowsi
, et al.
·
Microelectronics Reliability
·
7
Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages
2026
·
Sima Besharat Ferdowsi
, Sushil Doranga
, et al.
·
Journal of Electronic Packaging
PDF
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Works count:
3
Citation count:
18
H-index:
2
I10-index:
1
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