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Bin Cheng
Institution:
Hebei Academy of Sciences
Observed institution:
Hebei Academy of Sciences
ORCID:
0009-0007-6928-1620
Observed ORCID:
0009-0007-6928-1620
OpenAlex ID:
A5099247355
Research on Motion Optimization Design of Die-Cutting Mobile Platform
2026
·
Yunfei Zhou
, Cheng Wang
, et al.
·
Lecture notes in mechanical engineering
Simulation Analysis of Motion Characteristics of Die-Cutting Moving Platform
2025
·
Yunfei Zhou
, Cheng Wang
, et al.
·
International Conference on Artificial Intelligence and Smart Manufacturing
Numerical simulation of die-cutting mobile platform under different load conditions
2023
·
Ruoyu Cheng
, Bin Cheng
, et al.
·
International Conference on Mathematics and Machine Learning (ICMML)
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Works count:
3
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