Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Nan Wang
Observed name:
Wang, Nan
Institution:
Smart High Tech (Sweden)
Observed institutions:
Shanghai University,
Agency for Science, Technology and Research,
Tohoku University,
Institute of Microelectronics,
Smart High Tech (Sweden),
Chalmers University of Technology
show all 6
ORCID:
0000-0002-7609-5419
Observed ORCID:
0000-0002-7609-5419
OpenAlex ID:
A5100332765
Graphene related materials for thermal management
2019
·
Yifeng Fu
, Josef Hansson
, et al.
·
2D Materials
·
307
PDF
Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
2018
·
Nan Wang
, Majid Kabiri Samani
, et al.
·
Small
·
172
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application
2015
·
Yong Zhang
, Haoxue Han
, et al.
·
Advanced Functional Materials
·
144
Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures
2016
·
Nan Wang
, Santosh Pandit
, et al.
·
Carbon
·
90
Wafer-Level Vacuum-Packaged High-Performance AlN-on-SOI Piezoelectric Resonator for Sub-100-MHz Oscillator Applications
2017
·
Guoqiang Wu
, Jinghui Xu
, et al.
·
IEEE Transactions on Industrial Electronics
·
66
High porosity and light weight graphene foam heat sink and phase change material container for thermal management
2020
·
Abdelhafid Zehri
, Majid Kabiri Samani
, et al.
·
Nanotechnology
·
32
PDF
Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires
2015
·
Nan Wang
, Di Jiang
, et al.
·
Advanced Functional Materials
·
23
Improved Interfacial Bonding Strength and Reliability of Functionalized Graphene Oxide for Cement Reinforcement Applications
2019
·
Nan Wang
, Shuping Wang
, et al.
·
Chemistry - A European Journal
·
21
Surface Modification of Graphene for Use as a Structural Fortifier in Water-Borne Epoxy Coatings
2019
·
Ya Liu
, Chao Xia
, et al.
·
Coatings
·
19
PDF
Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
2016
·
Di Jiang
, Nan Wang
, et al.
·
Small
·
15
Graphene-based Biosensors for Biomolecules Detection
2014
·
Qing Zheng
, Hao Wu
, et al.
·
Current Nanoscience
·
15
Fabrication and characterization of laterally-driven piezoelectric bimorph MEMS actuator with sol–gel-based high-aspect-ratio PZT structure
2013
·
Shinya Yoshida
, Nan Wang
, et al.
·
Journal of Micromechanics and Microengineering
·
15
Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
2019
·
Shujing Chen
, Abdelhafid Zehri
, et al.
·
ChemistryOpen
·
12
PDF
Highly Thermal Conductive and Electrically Insulated Graphene Based Thermal Interface Material with Long-Term Reliability
2019
·
Nan Wang
, Ya Liu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Thermal characterization of power devices using graphene-based film
2014
·
Pengtu Zhang
, Nan Wang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Highly Thermal Conductive and Light-weight Graphene-based Heatsink
2019
·
Nan Wang
, Ya Liu
, et al.
·
European Microelectronics and Packaging Conference
·
10
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
2017
·
Di Jiang
, Shuangxi Sun
, et al.
·
Flexible and Printed Electronics
·
6
PDF
Reliability of graphene-based films used for high power electronics packaging
2015
·
Shirong Huang
, Yong Zhang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
5
Use of graphene-based films for hot spot cooling
2014
·
Yong Zhang
, Pengtu Zhang
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
5
Effect of sintering method on properties of nanosilver paste
2017
·
Qiaoran Zhang
, Jiawen Liu
, et al.
·
IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
·
4
Development and characterization of graphene enhanced thermal conductive adhesives
2016
·
Nan Wang
, Nikolaos Logothetis
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
4
2D heat dissipation materials for microelectronics cooling applications
2016
·
Yong Zhang
, Shirong Huang
, et al.
·
China Semiconductor Technology International Conference (CSTIC)
·
4
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
2019
·
Ya Liu
, Nan Wang
, et al.
·
IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
·
3
Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
2017
·
Yiqun Yang
, Hui Ye
, et al.
·
IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
·
3
Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material
2018
·
Nan Wang
, Shujing Chen
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
2
Show more works
View as search
Works count:
34
Citation count:
1,005
H-index:
12
I10-index:
16
Year
Topic
Type
