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Xin Liu

A Review on Analytical Modeling for Collapse Mode Capacitive Micromachined Ultrasonic Transducer of the Collapse Voltage and the Static Membrane Deflections
2021 · JiuJiang Wang, Xin Liu, et al. · Micromachines · 18
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A Novel Multi-Scale Entropy Approach for EEG-Based Lie Detection with Channel Selection
2025 · Jiawen Li, Guanyuan Feng, et al. · Entropy · 11
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Investigation of dynamic characteristics of fused silica hemispherical resonator with shock and harmonic excitation
2022 · Jianning Chu, Xin Liu, et al. · Measurement · 11
Experimental Characterization of an Embossed Capacitive Micromachined Ultrasonic Transducer Cell
2020 · Yuanyu Yu, Jiujiang Wang, et al. · Micromachines · 11
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Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
2023 · Tian Huang, Guisheng Gan, et al. · Microelectronics International · 8
A Low-Frequency Micro Accelerometer Based on Three-Lobed Leaf Spring and a Focus Probe
2019 · Rui-Jun Li, Zhen-Xin Chang, et al. · IEEE photonics journal · 8
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EEG-ERnet: Emotion Recognition based on Rhythmic EEG Convolutional Neural Network Model
2025 · Shuang Zhang, Chen Ling, et al. · Journal of Integrative Neuroscience · 7
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A capacitance sensing method with trans-impedance based readout circuit and adaptive filtering for micro-gyro
2023 · Yinyu Liu, Youjun Zeng, et al. · Review of Scientific Instruments · 6
A Novel Co-Designed Multi-Domain Entropy and Its Dynamic Synapse Classification Approach for EEG Seizure Detection
2025 · Guanyuan Feng, Jiawen Li, et al. · Entropy · 5
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A low noise capacitance to voltage readout circuit based on active feedback charge sensitive amplifier for micro-gyro
2024 · Yinyu Liu, Ke Gu, et al. · Review of Scientific Instruments · 5
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
2022 · Guisheng Gan, Shiqi Chen, et al. · Soldering and Surface Mount Technology · 4
Advances and Challenges of Capacitive Micromachined Ultrasonic Transducers in Medical Imaging
2026 · Yuanyu Yu, Xin Liu, et al. · Micromachines · 3
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Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding
2025 · Guisheng Gan, Hao Yang, et al. · Microelectronics International · 3
Rapid preparation and its performance of Cu/Cu high-temperature solder joints
2025 · Jun-feng Dou, Gui-sheng Gan, et al. · Materials Today Communications · 2
Boundary Conditions Analysis of Circular Capacitive Micromachined Ultrasonic Transducer (CMUT) Devices
2021 · Jiujiang Wang, Yuanyu Yu, et al. · Recent Patents on Engineering · 2
An Analytical Model for Bandwidth Enhancement of Air-Coupled Unsealed Helmholtz Structural CMUTs
2019 · Xin Liu, Yuanyu Yu, et al. · Journal of Sensors · 2
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An experimental investigation of modulation scheme for galvanic coupling intra-body communication in wireless body area network
2025 · Jia Wen Li, Xi Ming Ren, et al. · Physica Scripta · 1
An Improved Static Membrane Deflection Analysis for Collapse Mode CMUT Fabricated by Sacrificial Release Method
2023 · Jiujiang Wang, Xin Liu, et al. · IEEE Sensors Journal · 1
Design and Experiment of Capacitive Micromachined Ultrasonic Transducer Array for High-frequency Underwater Imaging
2020 · Yuanyu Yu, Jiujiang Wang, et al. · Recent Advances in Electrical & Electronic Engineering (Formerly Recent Patents on Electrical & Electronic Engineering) · 1
Failure rate calculation for NMOS devices under multiple failure mechanisms
2013 · Zhenwei Zhou, Xin Liu, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Bayesian-Optimized Collapse-Mode CMUT with Trenched Membrane for High Output Pressure
2026 · Yuanyu Yu, Xin Liu, et al. · Micromachines
A simple interface circuit for edge inference kernels based on SC-LNO memristor crossbar
2025 · Siqi Wang, Yinyu Liu, et al. · Microelectronics Journal
Research on CMUTs Design with Different Cell Arrangements
2023 · Xuewen Cao, Yuanyu Yu, et al. · Recent Patents on Engineering
Works count: 23
Citation count: 110
H-index: 7
I10-index: 4
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