Get started
Author

Junjie Li

A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics
2017 · Xing Yu, Junjie Li, et al. · Journal of Alloys and Compounds · 117
Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
2018 · Junjie Li, Qi Liang, et al. · Journal of Alloys and Compounds · 106
Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles
2017 · Junjie Li, Xing Yu, et al. · Journal of Alloys and Compounds · 56
Improved corrosion resistance of nickel-aluminum bronze by electron beam powder bed fusion
2022 · Wenzheng Zhai, Junjie Li, et al. · Materials Chemistry and Physics · 45
Scalable fabrication of carbon-based MEMS/NEMS and their applications: a review
2015 · Shulan Jiang, Tielin Shi, et al. · Journal of Micromechanics and Microengineering · 43
The novel Cu nanoaggregates formed by 5 nm Cu nanoparticles with high sintering performance at low temperature
2017 · Junjie Li, Tielin Shi, et al. · Materials Letters · 28
Optimizing electrocaloric effect of PbSc 0.5Ta 0.5O 3 ceramics near/below room temperature by ordering degree modulation
2025 · Ruowei Yin, Yuxuan Hou, et al. · Journal of Advanced Ceramics · 14
PDF
Size Distribution Control of Copper Nanoparticles and Oxides: Effect of Wet-Chemical Redox Cycling
2019 · Chen Chen, Siyi Cheng, et al. · Inorganic Chemistry · 13
Cu-Cu Bonding by Low-Temperature Sintering of Self-Healable Cu Nanoparticles
2019 · Junjie Li, Qi Liang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining
2018 · Jinhu Fan, Tielin Shi, et al. · Journal of Electronic Materials · 7
Controlling mechanical properties in CrAlN/(CrVTaTiW)N multilayers: The role of CrAlN layer thickness on microstructure evolution
2025 · Azfar Hameed, Yuchun Tu, et al. · Journal of Alloys and Compounds · 4
Detecting Out-of-Distribution Examples Via Class-Conditional Impressions Reappearing
2023 · Jinggang Chen, Xiaoyang Qu, et al. · IEEE International Conference on Acoustics Speech and Signal Processing · 4
PDF
Facile Preparation of Cu Micro-Nano Composite Particle Paste for Low Temperature Bonding
2019 · Yun Mou, Yang Peng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Properties of activated formic acid using for low- temperature all-copper interconnect assisted with nanoparticles paste
2024 · Mengdan Kong, Junjie Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
A novel pattern printing method of applying Ag nanoparticles to Cu pads for high density Cu-Cu interconnection
2019 · Qi Liang, Junjie Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Microstructural and Mechanical Evolution in Craln/(Crvtatiw)N X Multilayer Systems: A Comprehensive Investigation of Craln Layer Thickness Effects
2025 · Yanyan Yuan, Azfar Hameed, et al. · SSRN Electronic Journal
Low-temperature Cu-Cu bonding by self-reduction of particle-free Ag ion paste
2018 · Junjie Li, Tielin Shi, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Low temperature and low pressure Cu-Cu bonding with Ag doped Cu nanosolder paste
2016 · Junjie Li, Tielin Shi, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Works count: 18
Citation count: 452
H-index: 9
I10-index: 9
Year
Topic
Type