Get started
Author

Donghyun Kim

Three-Dimensional 128 Gb MLC Vertical nand Flash Memory With 24-WL Stacked Layers and 50 MB/s High-Speed Programming
2014 · Ki-Tae Park, Sangwan Nam, et al. · IEEE Journal of Solid-State Circuits · 287
Improved formaldehyde gas sensing properties of well-controlled Au nanoparticle-decorated In2O3 nanofibers integrated on low power MEMS platform
2019 · Dongha Im, Donghyun Kim, et al. · Journal of Material Science and Technology · 53
3D Hierarchically Structured Tin Oxide and Iron Oxide-Embedded Carbon Nanofiber with Outermost Polypyrrole Layer for High-Performance Asymmetric Supercapacitor
2023 · Chang-Min Yoon, Suk Jekal, et al. · Nanomaterials · 36
PDF
Facile Enhancement of Electrochemical Performance of Solid-State Supercapacitor via Atmospheric Plasma Treatment on PVA-Based Gel-Polymer Electrolyte
2023 · Dong-Hyun Kim, Suk Jekal, et al. · Gels · 30
PDF
Synthesis of LiDAR-Detectable True Black Core/Shell Nanomaterial and Its Practical Use in LiDAR Applications
2022 · Suk Jekal, Jiwon Kim, et al. · Nanomaterials · 30
PDF
Fabrication of Flexible All-Solid-State Asymmetric Supercapacitor Device via Full Recycling of Heated Tobacco Waste Assisted by PLA Gelation Template Method
2023 · Suk Jekal, Min-Sang Kim, et al. · Gels · 16
PDF
Development of Novel Colorful Electrorheological Fluids
2022 · Suk Jekal, Jiwon Kim, et al. · Nanomaterials · 16
PDF
Fabrication and characteristics of CO2-gas sensor using Li2CO3–Li3PO4–Al2O3 electrolyte and LiMn2O4 reference electrode
2001 · Dong-Hyun Kim, Ji-Young Yoon, et al. · Sensors and Actuators B Chemical · 13
A hybrid PPC method based on the empirical etch model for the 0.14μm DRAM generation and beyond
2003 · Chul-Hong Park, Soo-Han Choi, et al. · International Symposium on Quality Electronic Design (ISQED) · 2
Crack Area Analysis of SnPb and SnAg Solder Joints in Plastic Ball Grid Array Packages From Dye Penetration Studies
2003 · Changyoung Park, Jose Marcio Dias Filho, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 2
Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation
2003 · Donghyun Kim, Andrew Mawer, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
Impact of exercise intervention on IGF-1 signaling related to muscle regeneration and physical performance in aged mice
2025 · Taewan Kim, Jinkyung Cho, et al. · bioRxiv (Cold Spring Harbor Laboratory)
Physical Activity, Metabolic Syndrome, And Quality Of Life In Older Korean Adults With Physical Disabilities
2024 · Jinkyung Cho, Hyun-Sik Kang, et al. · Medicine & Science in Sports & Exercise
Effect of Treadmill exercise on IGF-1 Signaling Associated with Muscle Regeneration and Exercise Performance in Aging Mice
2023 · Taewan Kim, Youngyun Jin, et al. · Research Square
PDF
Effects of Dielectric Layer Thickness and Electrode Structures on High Xe AC-PDP
2012 · Jun Heo, Yun-Gi Kim, et al. · The Transactions of The Korean Institute of Electrical Engineers
Theoretical evaluation of performance in biaxially-strained GaAs and In0.75Ga0.25As NMOS DGFETs
2008 · Donghyun Kim, Tejas Krishnamohan, et al. · IEEE Silicon Nanoelectronics Workshop
Cobalt (Co) Electrode FBAR Devices Fabricated on Seven-layered Bragg Reflectors and Their resonance characteristics
2003 · Mai Linh, Munhyuk Yim, et al. · Journal of information and communication convergence engineering
A Multilayer Interconnect Process for 0.5um Logic Technology
1994 · Donghyun Kim, H.S. Oh, et al. · MRS Proceedings
Works count: 18
Citation count: 486
H-index: 8
I10-index: 8
Year
Topic
Type