Author

Lei Han

Observed names: Han Lei, Lei HAN

Institutions: Beijing University of Posts and Telecommunications, Jiangxi University of Science and Technology

Observed institutions: Central South University, Beijing University of Posts and Telecommunications, Santa Clara University, Peking University, Tencent (China), Wuhan University, State Key Laboratory of High Performance Complex Manufacturing, Jiangxi University of Science and Technology, China Southern Power Grid (China), Mississippi State University

ORCID: 0000-0002-2058-8214

Observed ORCID: 0000-0002-2058-8214

OpenAlex ID: A5100657626

Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs

2011 · Junhui Li, Bangke Ma, et al. · Microelectronics Reliability · 139

Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

2011 · Junhui Li, Linggang Liu, et al. · IEEE Electron Device Letters · 84

Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process

2011 · Li Junhui, Liu Linggang, et al. · IEEE Electron Device Letters · 46

Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging

2013 · Junhui Li, Xiaolong Zhang, et al. · Journal of Microelectromechanical Systems · 37

Graph-guided multi-task sparse learning model: a method for identifying antigenic variants of influenza A(H3N2) virus

2018 · Lei Han, Lei Li, et al. · Bioinformatics · 30

Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip–Chip Bonding

2012 · Li Junhui, Zhang Xiaolong, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 16

Short‐circuit diffusion of ultrasonic bonding interfaces in microelectronic packaging

2008 · Junhui Li, Lei Han, et al. · Surface and Interface Analysis · 15

Twist-Net: A multi-modality transfer learning network with the hybrid bilateral encoder for hypopharyngeal cancer segmentation

2023 · Shuo Zhang, Yang Miao, et al. · Computers in Biology and Medicine · 14

Wire bonding dynamics monitoring by wavelet analysis

2007 · Lei Han, Rongzhi Gao, et al. · Sensors and Actuators A Physical · 13

Atomic diffusion properties in wire bonding

2006 · Jun-hui LI, Fu-liang WANG, et al. · Transactions of Nonferrous Metals Society of China · 13

Architectures and Applications of U-net in Medical Image Segmentation: A Review

2023 · Jundi Wang, Lei Han, et al. · International Symposium on System Security, Safety, and Reliability (ISSSR) · 11

The synergistic effect of Zn2+ doping and NaF interfacial melting aid increases the ionic conductivity of Na3Zr2Si2.2P0.8O12

2024 · Chencheng Sun, Boyuan Wang, et al. · Ceramics International · 8

Enhancing traffic flow monitoring with machine learning integration on cloud data warehousing

2024 · Peiyuan Yang, Zhou Chen, et al. · Applied and Computational Engineering · 8

Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging

2011 · Junhui Li, Luhua Deng, et al. · Microelectronics Reliability · 8

CCS-Net: Cascade Detection Network With the Convolution Kernel Switch Block and Statistics Optimal Anchors Block in Hypopharyngeal Cancer MRI

2022 · Shuo Zhang, Yang Miao, et al. · IEEE Journal of Biomedical and Health Informatics · 7

HRTEM and X-ray diffraction analysis of Au wire bonding interface in microelectronics packaging

2010 · Li Junhui, Wang Ruishan, et al. · Solid State Sciences · 7

The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces

2009 · Li Junhui, Wang Ruishan, et al. · Microelectronic Engineering · 7

Interface features of ultrasonic flip chip bonding and reflow soldering in microelectronic packaging

2007 · Ji‐An Duan, Junhui Li, et al. · Surface and Interface Analysis · 7

The characteristics of ultrasonic vibration transmission and coupling in bonding technology

2004 · Lu Junhui, Tan Jianping, et al. · 7

Improve the cycling performance of solid-state sodium batteries through the design of a cathode interface buffering layer

2024 · Chencheng Sun, Longxing Xie, et al. · Applied Surface Science · 6

Experimental measurement of temperature and H2O concentration distribution in particle-free flames using water vapor integrated spectral band emission

2024 · Yong Cheng, Lei Han, et al. · Experimental Thermal and Fluid Science · 5

Multimodal Control of UAV Based on Gesture, Eye Movement and Voice Interaction

2023 · Ao Zhou, Lei Han, et al. · Lecture notes in electrical engineering · 5

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

2014 · Fuliang Wang, Junhui Li, et al. · Journal of Electronic Packaging · 5

Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging

2008 · Jun-hui Li, Lei Han, et al. · Journal of Central South University of Technology · 5

Enhancing traffic flow monitoring with machine learning integration on cloud data warehousing

2024 · Peiyuan Yang, Zhou Chen, et al. · Applied and Computational Engineering · 4

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Works count: 42

Citation count: 531

H-index: 11

I10-index: 11