Author

Yuan Bian

Observed name: Bian Yuan

Institutions: Southwest University of Science and Technology, Peking University, State Key Laboratory of Environmental-friendly Energy Materials

Observed institutions: Southwest University of Science and Technology, Central South University, Peking University, Air Force Engineering University, Institute of Microelectronics, State Key Laboratory of Powder Metallurgy, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, State Key Laboratory of Environmental-friendly Energy Materials

ORCID: 0009-0001-0809-4166

Observed ORCID: 0009-0001-0809-4166

OpenAlex ID: A5100669182

Construction of Z-Scheme System for Enhanced Photocatalytic H2 Evolution Based on CdS Quantum Dots/CeO2 Nanorods Heterojunction

2017 · Yongjin Ma, Yuan Bian, et al. · ACS Sustainable Chemistry & Engineering · 135

Self-integrated β-Bi2O3/Bi2O2.33@Bi2O2CO3 ternary composites: Formation mechanism and visible light photocatalytic activity

2017 · Yuan Bian, Yongjin Ma, et al. · Applied Surface Science · 73

Enhanced visible-light photocatalytic degradation by Mn 3 O 4 /CeO 2 heterojunction: a Z-scheme system photocatalyst

2018 · Yongjin Ma, Jing Jiang, et al. · Inorganic Chemistry Frontiers · 66

Phase Transformation Synthesis of Strontium Tantalum Oxynitride-Based Heterojunction for Improved Visible Light-Driven Hydrogen Evolution

2018 · Weixuan Zeng, Yuan Bian, et al. · ACS Applied Materials & Interfaces · 64

Simple and facile ultrasound-assisted fabrication of Bi2O2CO3/g-C3N4 composites with excellent photoactivity

2017 · Yongjin Ma, Yuan Bian, et al. · Journal of Colloid and Interface Science · 57

Controlling shape anisotropy of hexagonal CdS for highly stable and efficient photocatalytic H2 evolution and photoelectrochemical water splitting

2018 · Yongjin Ma, Yi Liu, et al. · Journal of Colloid and Interface Science · 53

Boosting charge transfer via molybdenum doping and electric-field effect in bismuth tungstate: Density function theory calculation and potential applications

2018 · Yuan Bian, Weixuan Zeng, et al. · Journal of Colloid and Interface Science · 48

Joint Trajectory Control, Power Control, and Collection Schedule in UAV-Assisted Anti-Jamming Wireless Data Collection With Imperfect CSI

2024 · Yuan Bian, Jianbo Hu, et al. · IEEE Communications Letters · 43

Construction of two dimensional Sr2Ta2O7/S-doped g-C3N4 nanocomposites with Pt cocatalyst for enhanced visible light photocatalytic performance

2019 · Weixuan Zeng, Yuan Bian, et al. · Applied Surface Science · 33

One-pot nitridation route synthesis of SrTaO2N/Ta3N5 type II heterostructure with enhanced visible-light photocatalytic activity

2019 · Weixuan Zeng, Sheng Cao, et al. · Journal of Colloid and Interface Science · 29

Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

2015 · Xin Sun, Runiu Fang, et al. · Microelectronic Engineering · 27

Improved photocatalytic hydrogen evolution by facet engineering of core-shell structural CdS@ZnO

2019 · Yi Liu, Rui Dong, et al. · International Journal of Hydrogen Energy · 26

Efficient hydrogen generation of indium doped BaTiO3 decorated with CdSe quantum dots: Novel understanding of the effect of doping strategy

2018 · Donglin Zhong, Wenwen Liu, et al. · International Journal of Hydrogen Energy · 20

Metal–organic framework-driven copper/carbon polyhedron: synthesis, characterization and the role of copper in electrochemistry properties

2018 · Lulu Qiao, Anquan Zhu, et al. · Journal of Materials Science · 18

Affine Formation Maneuver Control for Multi-Agent Based on Optimal Flight System

2024 · Chao Kang, Jihui Xu, et al. · Applied Sciences · 10

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Attitude-Tracking Control for Over-Actuated Tailless UAVs at Cruise Using Adaptive Dynamic Programming

2023 · Zihou He, Jianbo Hu, et al. · Drones · 10

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Development and characterization of a through-multilayer TSV integrated SRAM module

2013 · Yunhui Zhu, Shenglin Ma, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 10

Unveiling the Role of Oxygen Vacancies in Manganese Oxides for the Ammonium Perchlorate Thermal Decomposition

2025 · Xin Huang, Yuan Bian, et al. · Inorganic Chemistry · 8

Mechanical and electrical reliability assessment of bump-less wafer-on-wafer integration with one-time bottom-up TSV filling

2015 · Yong Guan, Yunhui Zhu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 7

Electrical measurement and analysis of TSV/RDL for 3D integration

2014 · Xin Sun, Runiu Fang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6

Alkali metal ions regulate the microstructural of MnO2 to promote the ammonium perchlorate thermal decomposition

2026 · Xin Huang, Jin Lu, et al. · Applied Surface Science · 5

A distortion cost modification strategy for adaptive pentary steganography

2016 · Yuan Bian, Guangming Tang, et al. · Multimedia Tools and Applications · 4

A wafer level through-stack-via integration process with one-time bottom-up copper filling

2014 · Yunhui Zhu, Shenglin Ma, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 4

Effect of additives on copper electroplating profile for TSV filling

2012 · Yunhui Zhu, Yuan Bian, et al. · International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) · 4

Parametric study, modeling of etching process and application for tapered through-silicon-via

2012 · Shenglin Ma, Xiao Zhong, et al. · International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) · 4

Works count: 40

Citation count: 774

H-index: 14

I10-index: 17