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Author

Hongwen Zhang

Observed names: H. Zhang, HongWen Zhang
ORCID: 0000-0003-2702-5956
Observed ORCID: 0000-0003-2702-5956
OpenAlex ID: A5100670033
A Brief Review on High-Temperature, Pb-Free Die-Attach Materials
2018 · Hongwen Zhang, Jonathan Minter, et al. · Journal of Electronic Materials · 99
CANLite: Anomaly Detection in Controller Area Networks with Multitask Learning
2022 · Prashanth Balaji, Majid Ghaderi, et al. · IEEE Vehicular Technology Conference · 14
High-temperature Pb-free die attach material project phase 1: Survey result
2017 · Lim Sze Pei, Binghua Pan, et al. · International Conference on Electronics Packaging (ICEP) · 13
Electromigration in tin-bismuth planar solder joints
2023 · Prabjit Singh, L. Palmer, et al. · International Conference on Electronics Packaging (ICEP) · 11
A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
2012 · HongWen Zhang, Ning-Cheng Lee · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 11
High Reliability High Melting Lead-free Mixed Biagx Solder Paste System
2012 · HongWen Zhang, Ning-Cheng Lee · IMAPSource Proceedings · 10
High lead solder failure and microstructure analysis in die attach power discrete packages
2016 · Kenny Chiong, HongWen Zhang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 9
High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges
2020 · Hongwen Zhang, Ning‐Cheng Lee · Wiley eBooks · 7
A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications
2022 · Hongwen Zhang, Sze Pei Lim, et al. · International Conference on Electronics Packaging (ICEP) · 6
Electromigration in Tin-bismuth Planar Solder Joints
2024 · Prabjit Singh, Larry Palmer, et al. · Transactions of The Japan Institute of Electronics Packaging · 5
High reliability high melting mixed lead-free BiAgX solder paste system
2012 · HongWen Zhang, Ning-Cheng Lee · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 5
Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints
2024 · P. Singh, L. Palmer, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints
2024 · Prabjit Singh, L. Palmer, et al. · Pan Pacific Symposium · 4
A Novel Lead-Free Low-Temperature Solder with Excellent Drop-Shock Re-sistance
2021 · Hongwen Zhang, Samuel Lytwynec, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
High-reliability, high-melting, lead-free, mixed solder paste System—BiAgXⓇ
2021 · HongWen Zhang, Ning-Cheng Lee · Review of Scientific Instruments · 4
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop-Shock Resistance
2021 · Hongwen Zhang, Samuel Lytwynec, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Novel Solder Alloy: Wide Service Temperature Capability for Automotive Applications
2018 · Jie Geng, HongWen Zhang, et al. · IEEE Power Electronics Magazine · 4
A novel high melting lead-free mixed solder paste system
2011 · HongWen Zhang, Ning-Cheng Lee · IEEE Electronics Packaging Technology Conference (EPTC) · 4
Electromigration-induced strain relaxation in Cu conductor lines
2011 · H. Zhang, G.S. Cargill · Journal of materials research/Pratt's guide to venture capital sources · 4
Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints
2024 · Prabjit Singh, L. Palmer, et al. · International Conference on Electronics Packaging (ICEP) · 3
Piloting and Evaluation of 5G-Enabled Road Safety and Cybersecurity Services
2023 · Tiia Ojanperä, Johan Scholliers, et al. · Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit) · 3
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications
2023 · Hongwen Zhang, Tyler Richmond, et al. · Journal of Microelectronics and Electronic Packaging · 3
PDF
A Novel High-Temperature Pb-Free Solder Paste with Enhanced Performance for Power Discrete Packaging Applications
2022 · Hongwen Zhang, Sze Pei Lim, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3
Reliability of BiAgX Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications
2013 · HongWen Zhang, Ning-Cheng Lee · Journal of Surface Mount Technology · 3
A Bismuth-free In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
2023 · HongWen Zhang, Tyler Richmond, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Works count: 75
Citation count: 256
H-index: 7
I10-index: 6
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