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Le Luo

pH-Dependent Dual-Mode Detection toward Uranium by a Zinc-Tetraphenylethylene Fluorescent Metal–Organic Framework
2023 · Jianbo Xiong, Jie Chen, et al. · Inorganic Chemistry · 13
Fault Diagnosis of Planetary Gear Train Crack Based on DC-DRSN
2024 · Le Luo, Yu Liu · Applied Sciences · 10
Studies on fabrication of high density MCM-D substrate by aluminum anodization techniques
2006 · Dapeng Zhu, Lichun Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 6
Lead Free SnAg Solder Bumping with Size sub 100 Microns
2006 · Xiaoqin Lin, Dapeng Zhu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Bifunctional amorphous NiMoS electrocatalyst for durable overall water splitting
2026 · Na Xu, Jiali Liu, et al. · International Journal of Hydrogen Energy · 3
The reliability study of sub 100 microns SnAg flip chip solder bump on FR4 substrate under thermal cycling
2008 · Xiaoqin Lin, Le Luo · International Conference on Electronic Packaging Technology (ICEPT) · 3
The Growth and Influencing Factors of Voids in SnAg Solder Bump and their Impact on Interfacial Bond Strength
2007 · Xiaoqin Lin, Le Luo · International Conference on Electronic Packaging Technology (ICEPT) · 3
System-level thermal management modeling of a supercomputer chassis
2006 · Gaowei Xu, Yingjun Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Thermo-mechanical Reliability Study of High I/Os Flip Chip On Laminated Substrate Based on FEA, RSM and Interfacial Fracture Mechanics
2006 · Yingjun Cheng, Gaowei Xu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Synthesis of PtCuM/rGO (M = Co, Mn, Cr) as electrocatalysts for the electrooxidation of methanol and formic acid
2025 · Fenglin Li, Junhao Zhong, et al. · Journal of Alloys and Compounds · 2
Investigation of Wet-Etching- and Multiinterconnection-Based TSV and Application in 3-D Hetero-Integration
2014 · Jiaotuo Ye, Xiao Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate
2007 · Gaowei Xu, Jian Zhou, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Multi-chip memory module vvith a flip-chip-on-chip structure and an optional center via hole for underfill dispensing
2004 · S.W.R. Lee, Yat Kit Tsui, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Influences of Package Structure and Material Thermal Conductivities on Thermal Performance of FC-BGA
2007 · Le Luo · Electronics & Packaging · 1
Mixed-valence Pr doping induces constrained polar nanoregions for boosted energy storage in (Na0.5K0.5)NbO3-based relaxor ferroelectric ceramics
2026 · Ning Zhao, Yulin Cao, et al. · Journal of Alloys and Compounds
Reverse Power Regulation System for Traction Power Supply Based on Mixed-Frequency Modulated MMC
2025 · Le Luo, Xiaohong Huang, et al. · IEEE International Conference on Power Science and Technology (ICPST)
Research on the Suppression of Crossing Power in Continuous Traction Power Supply System of Electrified Railway
2025 · Miaomiao Zhi, Xiaohong Huang, et al. · Asia Energy and Electrical Engineering Symposium (AEEES)
Collaborative Control Strategy for Mountainous Railway Traction Power Supply System Based on Co-Phase Compensation Device
2024 · Gongyu Jia, Xiaohong Huang, et al. · International Conference on Power and Renewable Energy (ICPRE)
Application of liquid crystal display in the field of dynamic wave display
2004 · Le Luo, Hao Yang, et al. · Journal of Chongqing University. English Edition
Works count: 19
Citation count: 57
H-index: 4
I10-index: 2
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