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Quang-Bang Tao

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
2016 · Van-Nhat Le, Lahouari Benabou, et al. · International Journal of Solids and Structures · 58
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Effects of microstructure and vibration parameters on mechanical properties of nanoimprinted FeNiCrCoCu high-entropy alloys
2023 · Van-Trung Pham, Thi-Nhai Vu, et al. · Physica B Condensed Matter · 22
A design of a new miniature device for solder joints’ mechanical properties evaluation
2016 · Quang-Bang Tao, Lahouari Benabou, et al. · Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 21
Computational study on the clamping mechanism in the injection molding machine
2022 · Van-Duong Le, Van-Thanh Hoang, et al. · The International Journal of Advanced Manufacturing Technology · 18
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Effect of Bonding Pressure and Joint Thickness on the Microstructure and Mechanical Reliability of Sintered Nano-Silver Joints
2026 · Phuoc-Thanh Tran, Quang-Bang Tao, et al. · Journal of Manufacturing and Materials Processing · 4
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Identifying Factors That Influence Pressure Ulcers by Numerical Simulation and Experimentation Methods
2020 · He-Thong Bui, Le-Van Nguyen, et al. · International Journal of Online and Biomedical Engineering (iJOE) · 1
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Micromechanical Model for Describing Intergranular Fatigue Cracking in an Innovative Solder Alloy
2017 · Van-Nhat Le, Lahouari Benabou, et al. · Lecture notes in civil engineering
Reliability and Failure Analysis of Novel Lead-free Solders
2017 · Quang-Bang Tao
Works count: 8
Citation count: 124
H-index: 4
I10-index: 4
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