Author

Bin Huang

2019 · Wenjie Lu, Xian Luo, et al. · Materials Chemistry and Physics · 99
2006 · B.X. Huang, X.D. Wang, et al. · Materials Science and Engineering A · 94
2021 · Wenjie Lu, Xian Luo, et al. · Journal of Material Science and Technology · 91
2020 · Wenjie Lu, Xian Luo, et al. · Materials Science and Engineering A · 86
2021 · Wenjie Lu, Kang Yan, et al. · Journal of Material Science and Technology · 82
2020 · Wenjie Lu, Xian Luo, et al. · Materials Chemistry and Physics · 63
2007 · X.D. Wang, B.X. Huang, et al. · Metallurgical and Materials Transactions A · 62
2020 · Wenjie Lu, Xian Luo, et al. · Journal of Alloys and Compounds · 59
2008 · B.X. Huang, X.D. Wang, et al. · Metallurgical and Materials Transactions A · 48
2015 · Yunfei Du, Chuntian Li, et al. · Soldering and Surface Mount Technology · 27
2016 · Mei Hua Liu, Rui Li, et al. · Journal of Thermal Analysis and Calorimetry · 20
2006 · Y.M Cheung, Arthur C. M. Chong, et al. · International Conference on Electronic Materials and Packaging · 15
2022 · Zhichao Ma, Bin Huang, et al. · Journal of Materials Research and Technology · 11
2022 · Lan Rao, Qingrui Yue, et al. · Journal of Building Engineering · 11
2008 · X.D. Wang, B.X. Huang, et al. · Philosophical Magazine Letters · 11
Works count: 37
Citation count: 1,117
H-index: 20
I10-index: 25
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