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Author

Stanley Lin

Observed names: Lin Stanley, S. C. Lin, S. Lin, Stanley C. Lin
Institution: MediaTek (Taiwan)
ORCID: 0009-0004-1066-4203
Observed ORCID: 0009-0004-1066-4203
OpenAlex ID: A5101461553
Ultra-low resistance ohmic contacts in graphene field effect transistors
2012 · J. S. Moon, M. Antcliffe, et al. · Applied Physics Letters · 151
Graphene FET-Based Zero-Bias RF to Millimeter-Wave Detection
2012 · J. S. Moon, H.-C. Seo, et al. · IEEE Electron Device Letters · 46
L-band carbon nanotube transistor amplifier
2011 · M. Eron, S. Lin, et al. · Electronics Letters · 36
Self-catalyzed growth of InP/InSb axial nanowire heterostructures
2011 · Marta Pozuelo, Hailong Zhou, et al. · Journal of Crystal Growth · 35
A 4″ wafer photostepper-based carbon nanotube FET technology for RF applications
2011 · M. Schroter, P. Kolev, et al. · IEEE MTT-S International Microwave Symposium digest · 20
Low-damage electron beam lithography for nanostructures on Bi2Te3-class topological insulator thin films
2023 · Molly P. Andersen, Linsey K. Rodenbach, et al. · Journal of Applied Physics · 14
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Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly
2018 · Chi-Yuan Chen, Ian Hsu, et al. · Electronic System-Integration Technology Conference (ESTC) · 12
Fine pitch high bandwidth flip chip package-on-package development
2017 · Ming-Che Hsieh, Stanley Lin, et al. · European Microelectronics and Packaging Conference · 10
7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package with Laser Assisted Bonding and Mass Reflow Technology
2019 · Ian Hsu, Chi-Yuan Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Graphene review: An emerging RF technology
2012 · J. S. Moon, M. Antcliffe, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 6
Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) Technology
2020 · Ian Hsu, Chi-Yuan Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package
2018 · ChiYuan Chen, Ian Hsu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Graphene transistors for RF applications: Opportunities and challenges
2011 · J. S. Moon, M. Antcliffe, et al. · International Semiconductor Device Research Symposium · 3
Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package
2024 · Ming-Che Hsieh, Pu-Shan Huang, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
フリップチップパッケージアセンブリにおける微細バンプピッチを可能にするレーザ支援ボンディング技術【jst・京大機械翻訳】
2018 · Chi‐Yuan Chen, Hsu Ian, et al. · IEEE Conference Proceedings
Works count: 15
Citation count: 350
H-index: 8
I10-index: 8
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