Author

Chao Du

Institution: Jinzhong University

Observed institutions: Jinzhong University, Taiyuan University of Science and Technology

ORCID: 0000-0003-1927-4178

Observed ORCIDs: 0000-0003-1927-4178, 0009-0005-3288-2217

OpenAlex ID: A5101515435

RETRACTED ARTICLE: Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass

2023 · Chao Du, Yali Zhao, et al. · Journal of Inorganic and Organometallic Polymers and Materials · 22

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Polyethylene Glycol-Based Solid Polymer Electrolytes: Encapsulation Materials with Excellent Anodic Bonding Performance

2017 · Chao Du, Cui-rong Liu, et al. · Journal of Inorganic and Organometallic Polymers and Materials · 9

Conductive polyurethane elastomer electrolyte (PUEE) materials for anodic bonding

2020 · Haocheng Zhao, Weixuan Zhang, et al. · RSC Advances · 8

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Synthesis and Bonding Performance of Conductive Polymer Containing Rare Earth Oxides

2017 · Chao Du, Cui-rong Liu, et al. · Journal of Inorganic and Organometallic Polymers and Materials · 8

Effect of Cooling Mode on Anodic Bonding Properties of Solid Polymer Electrolytes

2017 · Chao Du, Cui-rong Liu, et al. · Journal of Inorganic and Organometallic Polymers and Materials · 8

TMP-based hyperbranched polyurethane elastomer (HBPUE) packaging material applied to anodic bonding

2020 · Haocheng Zhao, Weixuan Zhang, et al. · Chemical Papers · 7

Effect of rare earth oxide CeO 2 on the anodic bonding performance of PEG-based MEMS encapsulation materials

2021 · Chao Du, Cuirong Liu, et al. · Advances in Mechanical Engineering · 4

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Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

2023 · Chao Du, Yali Zhao, et al. · Polymers · 2

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Preparation of an ABS-ZnO Composite for 3D Printing and the Influence of Printing Process on Printing Quality

2026 · Chao Du, Yali Zhao, et al. · Fibers · 1

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Flexible anodic bonding for the bonding between elastomer and metal

2022 · Haocheng Zhao, Cuirong Liu, et al. · Journal of Applied Polymer Science · 1

Residual stress and deformation analysis of static bonding multi-layer Pyrex7740 glass and aluminum

2015 · Xu Yin, Cuirong Liu, et al. · Journal of Wuhan University of Technology-Mater Sci Ed · 1

Effect of trace HfO2-containing inclusions on the creep-rupture behavior and fracture mechanism of recycled DZ125 superalloy at 980°C/235 MPa

2026 · Qin Wang, Zulfiqar Ali, et al. · Materials Science and Engineering A

Preparation and Anodic Bonding Properties of PEG-Based Bonding Encapsulation Materials

2026 · Chao Du, Yali Zhao · Processes

Preparation and Anodic Bonding Performance of (PEG)10LiClO4/NaAlOSiO Solid Electrolyte for Packaging

2026 · Chao Du, Yali Zhao · International Journal of Molecular Sciences

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Retraction Note: Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass

2026 · Chao Du, Yali Zhao, et al. · Journal of Inorganic and Organometallic Polymers and Materials

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Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface During Anodic Bonding of Peg-Based Encapsulation Materials and Al

2022 · Chao Du, Hao Liu, et al. · SSRN Electronic Journal

Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface During Anodic Bonding of Peg-Based Encapsulation Materials and Al

2022 · Chao Du, Yali Zhao, et al. · SSRN Electronic Journal

Works count: 17

Citation count: 71

H-index: 6

I10-index: 1