Get started
Author

Zhimin Wan

Observed name: Z. Wan
ORCID: 0000-0003-2223-2518
Observed ORCIDs: 0000-0003-2223-2518, 0000-0002-6312-9683
OpenAlex ID: A5101528455
Structural response reconstruction based on the modal superposition method in the presence of closely spaced modes
2013 · Zhimin Wan, Shande Li, et al. · Mechanical Systems and Signal Processing · 106
Pressure drop and heat transfer characteristics of pin fin enhanced microgaps in single phase microfluidic cooling
2017 · Zhimin Wan, Yogendra Joshi · International Journal of Heat and Mass Transfer · 58
PDF
A modified particle filter for parameter identification with unknown inputs
2018 · Zhimin Wan, Ting Wang, et al. · Structural Control and Health Monitoring · 27
PDF
A novel state space method for force identification based on the Galerkin weak formulation
2015 · Ting Wang, Zhimin Wan, et al. · Computers & Structures · 25
A Novel Coupled State/Input/Parameter Identification Method for Linear Structural Systems
2018 · Zhimin Wan, Ting Wang, et al. · Shock and Vibration · 21
PDF
Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs
2014 · Zhimin Wan, He Xiao, et al. · Microelectronics Journal · 18
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
2021 · Yuanchen Hu, Md Obaidul Hossen, et al. · Journal of Electronic Packaging · 16
Enhancement in CMOS chip performance through microfluidic cooling
2014 · Zhimin Wan, Wen Yueh, et al. · International Workshop on Thermal Investigations of ICs and Systems · 15
Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling
2014 · Zhimin Wan, Yogendra Joshi · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 14
Acoustic finite element model updating using acoustic frequency response function
2014 · Zhimin Wan, Ting Wang, et al. · Finite Elements in Analysis and Design · 13
Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling
2013 · Zhimin Wan, Yogendra K. Joshi · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 13
Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs
2013 · Zhimin Wan, He Xiao, et al. · International Workshop on Thermal Investigations of ICs and Systems · 12
Active Fluidic Cooling on Energy Constrained System-on-Chip Systems
2017 · Wen Yueh, Zhimin Wan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 11
A New Uncertain Analysis Method for the Prediction of Acoustic Field with Random and Interval Parameters
2016 · Mingjie Wang, Zhimin Wan, et al. · Shock and Vibration · 9
PDF
Thermal analysis and improvement of high power electronic packages
2011 · Zhimin Wan, Ling Xu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 9
Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
2012 · Zhimin Wan, Yoon Jo Kim, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 8
Effect of blind hole depth and shape of solder joint on the reliability of through silicon via (TSV)
2011 · Zhimin Wan, Xiaobing Luo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Thermal simulations in support of multi-scale co-design of energy efficient information technology systems
2015 · Yogendra Joshi, Banafsheh Barabadi, et al. · International Journal of Numerical Methods for Heat &amp Fluid Flow · 7
Structural response reconstruction for non-proportionally damped systems in the presence of closely spaced modes
2014 · Zhimin Wan, Ting Wang, et al. · Journal of Vibroengineering · 7
PDF
Leakage power characterization and minimization in 3D stacked multi-core chips with microfluidic cooling
2014 · He Xiao, Zhimin Wan, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 6
Single- and Multiphase Flow for Electronic Cooling
2017 · Yogendra Joshi, Zhimin Wan · Springer eBooks · 5
Experimental characterization of in-package microfluidic cooling on a System-on-Chip
2015 · Wen Yueh, Zhimin Wan, et al. · International Symposium on Low Power Electronics and Design (ISLPED) · 5
Internal gas mass loss analysis of inflatable space antenna reflector subjected to impact
2006 · Zhimin Wan · Ha'erbin gongye daxue xuebao · 4
Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
2013 · Zhimin Wan, Yogendra Joshi · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 3
Advances in the Numerical Investigations on Wrinkles in Space Membrane Structures
2007 · Zhimin Wan · Lixue jinzhan · 3
Works count: 51
Citation count: 440
H-index: 12
I10-index: 13
Year
Topic
Type