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Se‐Young Jang
Observed names:
S. -H. Jang,
S.H. Jang,
Se-Young Jang,
Se-young Jang,
Seyoung Jang
Institution:
Soongsil University
Observed institutions:
Soongsil University,
Korea Advanced Institute of Science and Technology,
Samsung (South Korea),
Korea Railroad Research Institute,
Samsung Electronics (South Korea),
Yeungnam University,
Jeonbuk National University
show all 7
ORCID:
0000-0002-1060-0267
Observed ORCID:
0000-0002-1060-0267
OpenAlex ID:
A5101593920
Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact
2007
·
Seungbae Park
, Chirag Shah
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
72
Peak Detection Algorithm for Vital Sign Detection Using Doppler Radar Sensors
2019
·
Ju-Yeon Kim
, Jae-Hyun Park
, et al.
·
Sensors
·
62
PDF
Grain Morphology of Intermetallic Compounds at Solder Joints
2002
·
Won Kyoung Choi
, Se-Young Jang
, et al.
·
Journal of materials research/Pratt's guide to venture capital sources
·
58
Design of online surface inspection system of hot rolled strips
2008
·
Guifang Wu
, Hoonsung Kwak
, et al.
·
IEEE International Conference on Automation and Logistics (ICAL)
·
38
Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion
1998
·
Se‐Young Jang
, Kyung‐Wook Paik
·
Soldering and Surface Mount Technology
·
24
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
2002
·
Se-Young Jang
, J. Wolf
, et al.
·
IEEE Transactions on Electronics Packaging Manufacturing
·
19
UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration
2002
·
Se-Young Jang
, J. Wolf
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
19
Under bump metallurgy study for Pb-free bumping
2002
·
Se-Young Jang
, Juergen Wolf
, et al.
·
Journal of Electronic Materials
·
13
Optimal design of the exhaust system layout to suppress the discharge noise from an idling engine
2011
·
J. -G. Ih
, C. -Y. Choi
, et al.
·
International Journal of Automotive Technology
·
8
Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability
2007
·
Hyoung-Joon Kim
, Chang-Kyu Chung
, et al.
·
Journal of Electronic Materials
·
8
Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
2004
·
Woon-Seong Kwon
, Hyoung-Joon Kim
, et al.
·
Journal of Electronic Packaging
·
6
Geometric Machining Mechanism of the Ultrasonic Drilling
2007
·
Sun Kyu Lee
, S.H. Jang
, et al.
·
Key engineering materials
·
5
Wafer level package solder joint reliability study for portable electronic devices
2005
·
Se-Young Jang
, Tae-Sang Park
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Ranked image generation for arithmetic coding in indexed color image
2005
·
Kang-Soo You
, Deuk-Su Han
, et al.
·
IEEE International Conference on e-Health Networking, Applications and Services (Healthcom)
·
4
An Illegal Distribution Platform Tracking Method Using IP Port Scanning
2023
·
In-Jae Park
, Jae-Chung Yoo
, et al.
·
Journal of Software Assessment and Valuation
·
3
PDF
A Feature Point Extraction and Identification Technique for Immersive Contents Using Deep Learning
2020
·
Byuong-Chan Park
, Se‐Young Jang
, et al.
·
Journal of IKEEE
·
3
On the nonlinear and time-varying acoustic modeling of the simplified intake or exhaust silencing system
2014
·
T. -K. Kim
, J. -G. Ih
, et al.
·
International Journal of Automotive Technology
·
3
Content-Based Image Retrieval using Shape Information of Central Object
2007
·
Se-Young Jang
, Hoon-Sung Kwak
·
International Conference on Advanced Communication Technology
·
3
Pb-free bumping technology and UBM (under bump metallurgy)
2002
·
Se-Young Jang
, Kyung-Wook Paik
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
3
Studies on the electroplated flip chip solder bumping processes and Solder/UBM (Under Bump Metallization) interfacial reactions = 전해도금 플립칩 솔더 범프 형성 공정 및 솔더/UBM (under bump metallization) 간의 계면반응에 관한 연구
2002
·
Se‐Young Jang
, 장세영
·
3
An Adaptive Information Collection Method for Collect Evidence of OTT Content Illegal Distribution Platform
2024
·
Woo-Seob Lee
, In-Jae Yoo
, et al.
·
Journal of Software Assessment and Valuation
·
2
PDF
Short-Range Radar Sensor System Using Continuous Wave Signals
2020
·
Jae-Hyun Park
, Ju-Yeon Kim
, et al.
·
The Journal of Korean Institute of Electromagnetic Engineering and Science
·
2
PDF
An Ultrasonic Wave Encoder and Decoder for Indoor Positioning of Mobile Marketing System
2019
·
Young Mo Kim
, Se‐Young Jang
, et al.
·
Journal of the Korea Society of Computer and Information
·
2
A New Parameter Selection Method of Neural Network
2008
·
Gui-fang Wu
, Se-young Jang
, et al.
·
International Conference on Multimedia and Ubiquitous Engineering (MUE)
·
2
Study on Bubble Formation in Rigid-Flexible Substrates Bonding using Anisotropic Conductive Films (ACFs) and Their Effects on the ACF Joint Reliability
2006
·
Hyoung-Joon Kim
, Chang-Kyu Chung
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
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Works count:
44
Citation count:
378
H-index:
8
I10-index:
8
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