Author

Wen Hu

Observed name: W. Y. Hu

Institution: Hefei Normal University

Observed institutions: Southwest University of Science and Technology, Central South University, Xidian University, Hefei Normal University, University of Wisconsin–Milwaukee, State Key Laboratory of Powder Metallurgy

ORCID: 0000-0002-8624-7850

Observed ORCID: 0000-0002-8624-7850

OpenAlex ID: A5101679718

Bioinspired Stable and Photoluminescent Assemblies for Power Generation

2019 · Kai Tao, Wen Hu, et al. · Advanced Materials · 133

Stable and optoelectronic dipeptide assemblies for power harvesting

2019 · Kai Tao, Bin Xue, et al. · Materials Today · 98

Peptide Coassembly to Enhance Piezoelectricity for Energy Harvesting

2022 · Hui Yuan, Peipei Han, et al. · ACS Applied Materials & Interfaces · 58

Vacancy buckling model for the (111) surface of III–V compound semiconductors

1985 · S. Y. Tong, G. Xu, et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 37

Electric Field-Assisted Self-Assembly of Diphenylalanine Peptides for High-Performance Energy Conversion

2023 · Yusen Su, Jing Liu, et al. · ACS Materials Letters · 36

Atomic geometry of the 2×2 GaP(111) surface

1985 · G. Xu, W. Y. Hu, et al. · Physical review. B, Condensed matter · 35

Revealing the relationships between alloy structure, composition and plastic deformation in a ternary alloy system by a combinatorial approach

2021 · Jianping Lai, Wen Hu, et al. · Journal of Material Science and Technology · 19

Structure, Mechanical and Thermal Properties of TiSiWN Coatings

2023 · Wen Hu, Jian W. Du, et al. · Coatings · 10

A first principles study of the adsorption and hydrogenation of formic acid on a Cu3Zn material: Implication for bulk alloying effect on CO2 hydrogenation reactivity of Cu/ZnO-based catalysts

2022 · Meng-Yuan Yao, Qian-Lin Tang, et al. · Computational Materials Science · 5

Enhancing hydrogen storage in TiVCrMn-based BCC alloys: a comparative study of Co, Ni, and Fe modifications

2026 · Jing Lin, Wen Hu, et al. · New Journal of Chemistry · 1

Dual-Mode Tdbs Analysis: Electromechanical Coupling Coefficient Test of Piezoelectric Film on Insulator

2025 · Pingxu Chen, Xianrui Shi, et al. · SSRN Electronic Journal

Works count: 11

Citation count: 432

H-index: 8

I10-index: 8