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Mohd Izrul Izwan Ramli

Observed names: M I I Ramli, M. I. I. Ramli, M.I.I. Ramli, Mohd Izrul Izwan RAMLI
Observed institution: Universiti Malaysia Perlis
ORCID: 0000-0002-7423-0058
Observed ORCID: 0000-0002-7423-0058
OpenAlex ID: A5101711285
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
2022 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 83
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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
2019 · M.I.I. Ramli, M.A.A. Mohd Salleh, et al. · Materials & Design · 67
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Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
2016 · M.I.I. Ramli, N. Saud, et al. · Microelectronics Reliability · 65
The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic
2022 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 46
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The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings
2019 · M. I. I. Ramli, M. A. A. Mohd Salleh, et al. · Journal of Electronic Materials · 35
Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength
2021 · S. F. N. Muhd Amli, M. A. A. Mohd Salleh, et al. · Journal of Electronic Materials · 23
Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering
2019 · M. I. I. Ramli, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 18
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
2021 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 16
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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
2020 · R. Mohd Said, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 14
Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
2018 · Mohd Izrul Izwan Ramli, M.S.S. Yusof, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 14
Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints
2021 · Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, et al. · Coatings · 13
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Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg
2022 · C.Y. Tan, M.A.A. Mohd Salleh, et al. · Materials Today Communications · 12
Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties
2020 · S. F. N. Muhd Amli, M. A. A. Mohd Salleh, et al. · Journal of Electronic Materials · 11
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder
2019 · Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 10
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Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste
2016 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 10
Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder
2022 · S. F. Muhd Amli, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 9
Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging
2022 · M. I. I. Ramli, M. A. A. Mohd Salleh, et al. · JOM · 9
The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy
2021 · M.S. Chang, M.A.A. Mohd Salleh, et al. · Journal of Alloys and Compounds · 9
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
2021 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 8
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Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
2018 · Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 8
Effect of Zinc Additions on Sn-0.7Cu-0.05Ni Lead-Free Solder Alloy
2017 · N A Saleh, M I I Ramli, et al. · IOP Conference Series Materials Science and Engineering · 7
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Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder
2016 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 7
Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement
2015 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Applied Mechanics and Materials · 7
Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging
2018 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 6
Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder
2014 · Norhayanti Mohd Nasir, Norainiza Saud, et al. · Materials science forum · 6
Works count: 69
Citation count: 599
H-index: 12
I10-index: 15
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