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Yuanchen Hu

Observed names: Hu Yuanchen, Hu, Yuanchen, Y. Hu, Y.-F Hu
Observed institutions: Jiangsu Normal University, Georgia Institute of Technology, IBM (United States), Xuzhou Medical College, Hebei University of Technology, China University of Petroleum, Beijing, Wuhan University, Tsinghua University
ORCID: 0000-0001-8632-6674
Observed ORCID: 0000-0001-8632-6674
OpenAlex ID: A5101716624
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
2016 · Daniel Lorenzini, Craig Green, et al. · International Journal of Heat and Mass Transfer · 138
A study on the application of scaling equation for asphaltene precipitation
2000 · Y.-F Hu, G.-J Chen, et al. · Fluid Phase Equilibria · 77
Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps
2017 · Thomas E. Sarvey, Yuanchen Hu, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 47
Cooling performance of bio-mimic perspiration by temperature-sensitive hydrogel
2014 · S. Cui, Y. Hu, et al. · International Journal of Thermal Sciences · 46
Effect of Curing Regime on the Mechanical Properties and Durability of Steam Cured-Concrete
2023 · Ling Wang, Wenzhu Wei, et al. · Buildings · 26
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Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration
2020 · Yuanchen Hu, Yogendra Joshi · IEEE Transactions on Components Packaging and Manufacturing Technology · 18
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
2021 · Yuanchen Hu, Md Obaidul Hossen, et al. · Journal of Electronic Packaging · 16
Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array
2017 · Yuanchen Hu, Thomas Sarvey, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 12
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks
2015 · Caleb Serafy, Zhiyuan Yang, et al. · IEEE Design and Test · 10
Bio-mimic transpiration cooling using temperature-sensitive hydrogel
2012 · Yuanchen Hu · Journal of Chemical Industry and Engineering · 10
Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array
2020 · Yuanchen Hu, Thomas Sarvey, et al. · ASME Journal of Heat and Mass Transfer · 9
Air-Cooled Battery-Pack Thermals and Capacities Under Various Operating Temperatures and Processes
2020 · Yuanchen Hu, Xiangfei Yu, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 7
Passive and Active Thermal Technologies: Modeling and Evaluation
2019 · Craig E. Green, Vivek Sahu, et al. · Wiley eBooks · 7
Design and Parametric Study of Microfluidic Cooling Manifold for 2.5D-SICs with Dielectric Coolant
2018 · Yuanchen Hu, Thomas Sarvey, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 6
Mitigating Hot Spots in Planar and Three-dimensional (3d) Heterogeneous Microsystems Using Liquid Cooling
2017 · Yogendra K. Joshi, Yuanchen Hu, et al. · International Symposium on Advances in Computational Heat Transfer (CHT) · 6
Thermosyphon-Cooled Three-Dimensional Stacked Heat Sources
2021 · Yuanchen Hu, Yogendra Joshi · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Simulation study of auto-disturbance rejection controller for high order systems
2001 · Yuanchen Hu · Journal of Tsinghua University(Science and Technology) · 5
Impact of Aisle Containment Solutions using Detailed Server Simulation Models in Data Centers
2021 · Yuanchen Hu, Dustin W. Demetriou · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
Infrared Radiation Transparent Film Impact on Thermal Measurement
2021 · Yuanchen Hu, Milnes P. David, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
Transient CFD Heat Transfer Simulation Model of Air-Cooled Battery Packs
2020 · Yuanchen Hu, Xiangfei Yu, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
Cold Plate Pin-Fin Optimization for Multi-Die Systems Using Design of Experiment
2019 · Yuanchen Hu, Yogendra Joshi · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
Immersion Oil Thermal Performance Characteristics and Comparisons
2024 · Yuanchen Hu, Milnes P. David · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2
Unusual Fast Evaporation From Nanoholes
2012 · Zhi Huang, Yuanchen Hu, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 2
Heat Pipe Thermal Performance in Heat Pipe Heatsink
2022 · Yuanchen Hu, Milnes P. David, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Thermal Design of Portable Modular High Performance Computing Data Centers
2021 · Anil Yuksel, Dustin W. Demetriou, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Works count: 36
Citation count: 465
H-index: 10
I10-index: 10
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