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Norliza Ismail

Observed names: N. Ismail, N.A. Ismail
ORCID: 0000-0001-5274-8967
Observed ORCID: 0000-0001-5274-8967
OpenAlex ID: A5101802800
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
2024 · Norliza Ismail, Wan Yusmawati Wan Yusoff, et al. · Defence Technology · 78
Effect of alumina trihydrate as additive on the mechanical properties of kenaf/polyester composite for plastic encapsulated electronic packaging application
2020 · A. Atiqah, M.N.M Ansari, et al. · Journal of Materials Research and Technology · 48
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A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
2022 · N. Ismail, A. Atiqah, et al. · Journal of Manufacturing Processes · 43
Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
2019 · Wan Yusmawati Wan Yusoff, Norliza Ismail, et al. · Soldering and Surface Mount Technology · 24
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
2020 · Norliza Ismail, Azman Jalar, et al. · Soldering and Surface Mount Technology · 20
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
2020 · Norliza Ismail, Azman Jalar, et al. · Soldering and Surface Mount Technology · 20
Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes
2021 · Norliza Ismail, Azman Jalar, et al. · Nanomaterials and Nanotechnology · 18
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
2022 · Wan Yusmawati Wan Yusoff, Norliza Ismail, et al. · Soldering and Surface Mount Technology · 17
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
2018 · Norliza Ismail, Roslina Ismail, et al. · Journal of Materials Science Materials in Electronics · 17
A comprehensive review of radiation effects on solder alloys and solder joints
2024 · Norliza Ismail, Wan Yusmawati Wan Yusoff, et al. · Defence Technology · 16
Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements
2022 · M. A. Bakar, A. Jalar, et al. · Topics in mining, metallurgy and materials engineering · 14
Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma
2018 · Norliza Ismail, Azman Jalar, et al. · Sains Malaysiana · 12
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Microstructural evolution of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder joints induced by variation doses of gamma-irradiation
2023 · Norliza Ismail, Wan Yusmawati Wan Yusoff, et al. · Journal of Materials Science Materials in Electronics · 10
Flux Modification for Wettability and Reliability Improvement in Solder Joints
2022 · N. Ismail, A. Jalar, et al. · Topics in mining, metallurgy and materials engineering · 9
Surface Roughness and Wettability of SAC/CNT Lead Free Solder
2016 · Norliza Ismail, Roslina Ismail, et al. · Materials science forum · 8
Kesan Penuaan Sesuhu terhadap Sifat Mikro Kekerasan Pempaterian Sn-Ag-Cu/CNT/Cu menggunakan Pelekukan Nano
2019 · Norliza Ismail, Azman Jalar, et al. · Sains Malaysiana · 7
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Effect of Temperature on Strain-Induced Hardness of Lead-Free Solder Wire using Nanoindentation Approach
2020 · Norliza Ismail, Maria Abu Bakar, et al. · Sains Malaysiana · 6
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Influence of Gamma Radiation on Eutectic Phase Area and Hardness Properties of Sac305 Solder
2022 · Nur Farisa Nadia Mohmad Lehan, Wan Yusmawati Wan Yusoff, et al. · Jurnal Teknologi · 4
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Effect of Shock Wave on Constant Load Behaviour of Pb-Free/Cnt Solder Joint
2020 · Norliza Ismail, Azman Jalar, et al. · Sains Malaysiana · 4
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Effect of Gamma Radiation on Micromechanical Behavior of Snpb Solder Alloy
2021 · Noor Fadhilah Rahmat, Wan Yusmawati Wan Yusoff, et al. · Journal of Defence Science Engineering & Technology · 3
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Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints
2022 · A. Atiqah, A. Jalar, et al. · Topics in mining, metallurgy and materials engineering · 2
Properties of Recycled Metal Matrix Composites
2021 · A. Atiqah, N. Ismail, et al. · CRC Press eBooks · 2
Effect of Blast Wave on Intermetallics Formation, Hardness and Reduced Modulus Properties of Solder Joints
2020 · Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 2
Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano
2019 · Maria Abu Bakar, Azman Jalar, et al. · Sains Malaysiana · 2
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The Effect of Temperature on Tin Whisker Growth under Mechanical Stress
2018 · Z. Mahim, N.A. Ismail, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 2
Works count: 34
Citation count: 392
H-index: 12
I10-index: 13
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