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Hocheol Lee

A 1.2 V 12.8 GB/s 2 Gb Mobile Wide-I/O DRAM With 4 $\times$ 128 I/Os Using TSV Based Stacking
2011 · Jung-Sik Kim, Chi Sung Oh, et al. · IEEE Journal of Solid-State Circuits · 205
A 1.2V 12.8GB/s 2Gb mobile Wide-I/O DRAM with 4×128 I/Os using TSV-based stacking
2011 · Jung-Sik Kim, Chi Sung Oh, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 46
28.5 A 1.2V 12.8GB/s 2Gb Mobile Wide-I/O DRAM with 4×128 I/Os Using TSV-Based Stacking
2011 · Jung‐Sik Kim, Hocheol Lee, et al. · 39
Wave selection using a magnetomechanical sensor in a solid cylinder
2002 · Hocheol Lee, Yoon Young Kim · The Journal of the Acoustical Society of America · 37
Beam vibration control using cellulose-based Electro-Active Paper sensor
2010 · Jungyun Kim, Hocheol Lee, et al. · International Journal of Precision Engineering and Manufacturing · 32
Bulk-Si photonics technology for DRAM interface [Invited]
2014 · Hyunil Byun, Jinkwon Bok, et al. · Photonics Research · 27
Vibration Sensor Characteristics of Piezoelectric Electro-active Paper
2010 · Jungyun Kim, Hocheol Lee, et al. · Journal of Intelligent Material Systems and Structures · 23
Airbag tool polishing for aspherical glass lens molds
2010 · Hocheol Lee, Junguk Kim, et al. · Journal of Mechanical Science and Technology · 21
Imaging performance of an ultra-precision machining-based Fresnel lens in ophthalmic devices
2021 · Van Truong Vu, Syed Azkar Ui Hasan, et al. · Optics Express · 19
A Compact Model for Channel Coupling in Sub-30 nm NAND Flash Memory Device
2011 · Myounggon Kang, Wookghee Hahn, et al. · Japanese Journal of Applied Physics · 15
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CMOS chip planarization by chemical mechanical polishing for a vertically stacked metal MEMS integration
2003 · Hocheol Lee, Michele H Miller, et al. · Journal of Micromechanics and Microengineering · 12
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Si-based optical I/O for optical memory interface
2012 · Kyoungho Ha, Dongjae Shin, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10
FPGA-based DDR3 DRAM interface using bulk-Si optical interconnects
2013 · Hyunil Byun, In-sung Joe, et al. · IEEE International Conference on Group IV Photonics (GFP) · 9
DIBL-Induced Program Disturb Characteristics in 32-nm NAND Flash Memory Array
2011 · Myounggon Kang, Wookghee Hahn, et al. · IEEE Transactions on Electron Devices · 9
A 512 Mb Two-Channel Mobile DRAM (OneDRAM) With Shared Memory Array
2008 · Jung-Sik Kim, Kyungwoo Nam, et al. · IEEE Journal of Solid-State Circuits · 9
A Simple compact model for hot carrier injection phenomenon in 32 nm NAND flash memory device
2010 · Myounggon Kang, Wookghee Hahn, et al. · IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) · 7
High diopter spectacle using a flexible Fresnel lens with a combination of grooves
2022 · Van Truong Vu, Hankil Yeon, et al. · Optics Express · 6
Image formation by a biological curved mirror array of the fisheye in the deep-sea environment
2021 · Hieu Tran Doan Trung, Donguk Lee, et al. · Applied Optics · 4
A 512 mb 2-channel mobile DRAM (oneDRAM™) with shared memory array
2007 · Kyungwoo Nam, Jung-Sik Kim, et al. · IEEE Asian Solid-State Circuits Conference (A-SSCC) · 3
Planarization of a CMOS die for an integrated metal MEMS
2003 · Hocheol Lee, Michele H. Miller, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Semi-analytic formulation and its experimental verification to determine the radiation patterns of ultrasonic guided waves generated on a plate by a magnetostrictive patch transducer
2015 · Hocheol Lee, Yoon Young Kim · Journal of Mechanical Science and Technology · 2
MEMS spatial light modulators with integrated electronics
2003 · Thomas Becker, Thomas G. Bifano, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Design and Fabrication of Micro-Fresnel Lens Array for Optical Imaging Applications
2025 · Van Truong Vu, Hien Nguyen, et al. · International Journal of Precision Engineering and Manufacturing · 1
Image Quality Analysis and Testing Process for Microlens Array-Based Optical Devices with High-Resolution Image Reconstruction
2024 · Van Truong Vu, Hyunbean Yi, et al. · International Journal of Precision Engineering and Manufacturing · 1
Seismic response of an electrical switchboard with vibration absorbers during earthquake excitation
2023 · Van Truong Vu, Hankil Yeon, et al. · Journal of Mechanical Science and Technology · 1
Works count: 50
Citation count: 549
H-index: 11
I10-index: 12
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