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Ke Zhan
Observed name:
Zhan, Ke
Institutions:
University of Shanghai for Science and Technology,
Ghent University
Observed institutions:
University of Shanghai for Science and Technology,
Ghent University,
Tsinghua–Berkeley Shenzhen Institute,
Tsinghua Shenzhen International Graduate School,
Tsinghua University
ORCID:
0000-0001-9504-6500
Observed ORCID:
0000-0001-9504-6500
OpenAlex ID:
A5101824260
Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge
2024
·
Ke Zhan
, Yucong Chen
, et al.
·
Nature Communications
·
177
PDF
A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets
2023
·
Lanshu Xu
, Ke Zhan
, et al.
·
ACS Nano
·
74
Fabrication of graphite/Cu composite foils with ultrahigh thermal conductivity by adding an intermediate nickel layer and vacuum hot pressing treatment
2021
·
Ke Zhan
, Rui Zhao
, et al.
·
Journal of Alloys and Compounds
·
28
Anisotropic Heat Transfer in a Fibrous Membrane with Hierarchically Assembled 2D Materials
2024
·
Yu Du
, Fangzheng Zhen
, et al.
·
ACS Applied Materials & Interfaces
·
13
Superacid assisted high-throughput production and solution-processing of pristine two-dimensional materials
2025
·
Qixuan Deng
, Jiabin Ma
, et al.
·
Materials Today
·
8
Flash Soldering of Boron Nitride Nanosheets for All-Ceramic Films
2024
·
Siyuan Ding
, Ke Zhan
, et al.
·
Chemical Engineering Journal
·
8
PDF
Ultrafast sintering of boron nitride nanosheet assembled microspheres with strong processability for high-performance thermal management materials
2024
·
Siyuan Ding
, Fangzheng Zhen
, et al.
·
Journal of Materials Chemistry A
·
7
High through-plane thermal conductivity of graphite films with opened micro-window arrays
2025
·
Yulun Zhang
, Ke Zhan
, et al.
·
Journal of Colloid and Interface Science
·
6
Microstructure and high thermal conductivity of Cu/CNTs-GO/Cu sandwich composite foils prepared by a novel electrodeposition-ultrasonic spraying and hot pressing sintering method
2026
·
Zhanfeng Lu
, Jianan Liu
, et al.
·
Materials Characterization
Inkjet-Printed Vertical Interconnects for Flip-Chip-on-Board and Flip-Chip-on-Flex Applications
2026
·
Donaldson, Preston D.
, Sohail, Linta
, et al.
·
Zenodo (CERN European Organization for Nuclear Research)
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Works count:
12
Citation count:
326
H-index:
7
I10-index:
4
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