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Juan Gómez

Observed names: Gomez, Juan, Gómez, Juan, J. Gomez, Juan D. Gomez, Juan David Gómez, Juan Gomez
Institution: Universidad EAFIT
ORCID: 0000-0003-1809-8766
Observed ORCID: 0000-0003-1809-8766
OpenAlex ID: A5102025609
Shear wave filtering in naturally-occurring Bouligand structures
2015 · Nicolás Guarín-Zapata, Juan Gomez, et al. · Acta Biomaterialia · 130
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Evaluation of Simplified Methods of Analysis of Yielding Structures with Damping Systems
2002 · Oscar M. Ramirez, Michael C. Constantinou, et al. · Earthquake Spectra · 93
A Damage-Mechanics-Based Constitutive Model for Solder Joints
2004 · C. Basaran, Y. Zhao, et al. · Journal of Electronic Packaging · 43
A General-Purpose Element-Based Approach to Compute Dispersion Relations in Periodic Materials with Existing Finite Element Codes
2019 · Camilo Valencia, Juan Gomez, et al. · Journal of Theoretical and Computational Acoustics · 9
Simplified Evaluation of Ground Motion Amplification in the Vicinity of a Topographic Feature
2021 · César Sierra, Juan Jaramillo, et al. · Journal of Earthquake Engineering · 5
Seismic response of three-dimensional rockfill dams using the Indirect Boundary Element Method
2010 · Francisco J Sánchez-Sesma, Mauricio Arellano-Guzmán, et al. · IOP Conference Series Materials Science and Engineering · 5
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Flipping a Computational Modeling Class: Strategies to Engage Students and Foster Active Learning
2020 · Juan David Ortega-Alvarez, Camilo Vieira, et al. · IEEE Frontiers in Education Conference (FIE) · 3
The scattering of SH waves by a finite crack with a superposition-based diffraction technique
2016 · Camilo Valencia, Juan Gomez, et al. · Studia Geophysica et Geodaetica · 3
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Construction of rational models for topographic effects and size-conditioned-response-spectra
2020 · Juan Vergara, César Sierra, et al. · Soil Dynamics and Earthquake Engineering · 2
A novel simple procedure to consider seismic soil structure interaction effects in 2D models
2014 · Juan Diego Jaramillo, Juan David Gómez, et al. · Earthquake Engineering and Engineering Vibration · 2
Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters *
2006 · Douglas C. Hopkins, D. Kellerman, et al. · 2
Flipping a Computational Modeling Class: Strategies to Engage Students and Foster Active Learning
2020 · Nicolas Guarin-Zapata, Juan David Gómez, et al. · EdArXiv (OSF Preprints)
Seismic Wave Scattering Through a Compressed Hybrid BEM/FEM Method
2014 · Guarín-Zapata, Nicolás, Gómez, Juan, et al. · arXiv (Cornell University)
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Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
2007 · Cemal Basaran, Juan Gómez, et al. · Summer Computer Simulation Conference
Algoritmo De Integración Para Materiales No Lineales Considerando Los Efectos De Viscoplasticidad, Endurecimiento Cinemático No Lineal Y Daño
2005 · Juan Gómez · EIA University Library (EIA University)
Works count: 16
Citation count: 300
H-index: 5
I10-index: 3
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