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Author

Chon-Hsin Lin

ORCID: 0009-0004-9108-7398
Observed ORCID: 0009-0004-9108-7398
OpenAlex ID: A5102102813
Some aspects of new Cu(NbC) films
2019 · Chon-Hsin Lin · Bulletin of Materials Science · 69
Copper–Holmium Alloy Film for Reliable Interconnects
2010 · Chon-Hsin Lin, Wen-Kuan Leau, et al. · Japanese Journal of Applied Physics · 13
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Cu(TiWNx) Film as a Barrierless Buffer Layer for Metallization Applications
2013 · Chon-Hsin Lin, Hsin-Yi Chuang, et al. · Japanese Journal of Applied Physics · 9
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A New Copper Alloy Film for Barrierless Si Metallization and Solder Bump Flip-Chip Application
2013 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 7
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New Cu(TiBN x ) copper alloy films for industrial applications
2016 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 6
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New Copper Alloy, Cu(SnNx), Films Suitable for More Thermally Stable, Electrically Reliable Interconnects and Lower-Leakage Current Capacitors
2011 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 6
New Cu(GeN x ) film in barrierless metallization for LED heat dissipation
2015 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 5
Newly-Developed Cu(NbZrNx) Copper-Alloy Films for Microelectronic Manufacture Advancement
2022 · Chon-Hsin Lin · MATERIALS TRANSACTIONS · 4
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A new Cu(NbCNx) film and some of its characteristics
2020 · Chon-Hsin Lin · Microelectronic Engineering · 4
New Cu(AuTiN x ) copper alloy film and its features
2015 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 4
A new Cu(GeNx) alloy film for industrial applications
2014 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 3
A new Cu(TiIrNx) film with fine thermal conductivity and its application
2014 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 3
New Cu(TiIrNx) Alloy Films for Solder Bump Flip-Chip Application
2013 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 3
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New Copper Alloy, Cu(SnNx), Films Suitable for More Thermally Stable, Electrically Reliable Interconnects and Lower-Leakage Current Capacitors
2011 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 3
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A newly developed Cu(Rh) alloy film and its characteristics and applications
2024 · Chon-Hsin Lin · AAPPS bulletin · 2
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A new Cu(TiBN x ) alloy film for boosting the per-watt illuminance of high power LEDs
2016 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 2
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A Thermally-Reliable, Low-Resistivity Cu(Ir) and Cu(IrN) Alloy Films for Barrierless Cu Metallization
2012 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 2
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Cu(ReTaNx) Copper Alloy Films Suitable for Electronic-Device Manufacturing-Process Simplification
2012 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 1
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Cu(ReTaNx) Copper Alloy Films Suitable for Electronic-Device Manufacturing-Process Simplification
2012 · Chon-Hsin Lin · Japanese Journal of Applied Physics · 1
Practical relevance of Cu(Os) interconnects in microelectronics
2026 · Chon-Hsin Lin · AIP Advances
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Erratum: “New Cu(GeN x ) film in barrierless metallization for LED heat dissipation”
2016 · Chon-Hsin Lin · Japanese Journal of Applied Physics
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New Cu(TiBN
2016 · Chon-Hsin Lin · Japanese Journal of Applied Physics
New Cu(AuTiN
2015 · Chon-Hsin Lin · Japanese Journal of Applied Physics
New Cu(GeN
2015 · Chon-Hsin Lin · Japanese Journal of Applied Physics
A new Cu(TiIrN
2014 · Chon-Hsin Lin · Japanese Journal of Applied Physics
Works count: 28
Citation count: 147
H-index: 6
I10-index: 2
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