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Ja‐Myeong Koo

Observed names: Ja Myeong Koo, Ja-Myeong Koo, Jamyeong Koo, Koo Ja-Myeong, 구자명
OpenAlex ID: A5102103383
Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
2004 · Jeong-Won Yoon, Sang-Won Kim, et al. · Journal of Electronic Materials · 85
Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing
2020 · Ju Seung Lee, Seung Ji Kang, et al. · Advanced Materials · 47
Effect of substrate metallization on mechanical properties of Sn–3.5Ag BGA solder joints with multiple reflows
2005 · Ja-Myeong Koo, Seung-Boo Jung · Microelectronic Engineering · 47
Laser-Induced Graphene on Additive Manufacturing Parts
2019 · Lishi Jiao, Zhong Yang Chua, et al. · Nanomaterials · 45
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Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions
2007 · Jeong-Won Yoon, Hyun-Suk Chun, et al. · Scripta Materialia · 44
Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications
2006 · Jeong-Won Yoon, Hyun-Suk Chun, et al. · Microsystem Technologies · 41
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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages
2019 · Kwang-Ho Jung, Kyung Deuk Min, et al. · Applied Surface Science · 37
Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging
2006 · Ja-Myeong Koo, Seung-Boo Jung · Microelectronics Reliability · 35
Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
2007 · Dae-Gon Kim, Jong-Woong Kim, et al. · Journal of Alloys and Compounds · 32
Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method
2008 · Jeong-Won Yoon, Hyun-Suk Chun, et al. · Microelectronics Reliability · 31
Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder
2007 · Jeong-Won Yoon, Ja-Myeong Koo, et al. · Journal of Alloys and Compounds · 27
Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process
2005 · Ja-Myeong Koo, Seung-Boo Jung · Journal of Electronic Materials · 26
Friction welding of TiAl and AISI4140
2004 · Won-Bae Lee, Myoung-Gyun Kim, et al. · Journal of Materials Science · 22
Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
2007 · Ja-Myeong Koo, Seung-Boo Jung · Microsystem Technologies · 20
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Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding
2008 · Bo-In Noh, Ja-Myeong Koo, et al. · Japanese Journal of Applied Physics · 18
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Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows
2007 · Ja-Myeong Koo, Bui Quoc Vu, et al. · Journal of Electronic Materials · 18
Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows
2005 · Ja Myeong Koo, Young Ho Lee, et al. · Key engineering materials · 18
Effect of Zn addition on mechanical properties of brass hollow spheres
2007 · Ja-Myeong Koo, Hideki Araki, et al. · Materials Science and Engineering A · 13
Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
2007 · Jong-Woong Kim, Dae-Gon Kim, et al. · MATERIALS TRANSACTIONS · 12
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Thermal degradation of anisotropic conductive film joints under temperature fluctuation
2007 · Jong-Woong Kim, Ja-Myeong Koo, et al. · International Journal of Adhesion and Adhesives · 11
Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process
2006 · Ja‐Myeong Koo, Jeong‐Won Yoon, et al. · Surface and Interface Analysis · 10
Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics
2022 · Hee-Bo Ha, Byung Hoon Lee, et al. · Intermetallics · 9
Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows
2008 · Ja-Myeong Koo, Jeong-Won Yoon, et al. · Journal of materials research/Pratt's guide to venture capital sources · 9
Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards
2008 · Jong-Bum Lee, Ja-Myeong Koo, et al. · Japanese Journal of Applied Physics · 9
Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
2008 · Ja-Myeong Koo, Jung-Lae Jo, et al. · Japanese Journal of Applied Physics · 9
Works count: 66
Citation count: 757
H-index: 17
I10-index: 21
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