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Chun‐Te Lin

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor
2009 · Tsung-Lin Chou, Chen-Hung Chu, et al. · Sensors and Actuators A Physical · 77
Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology
2004 · Chih-Tang Peng, Ji-Cheng Lin, et al. · Sensors and Actuators A Physical · 58
Preparation and properties of bisphenol-F based boron-phenolic resin/modified silicon nitride composites and their usage as binders for grinding wheels
2015 · Chun-Te Lin, Hsun-Tsing Lee, et al. · Applied Surface Science · 42
Reliability tests for a three dimensional chip stacking structure with through silicon via connections and low cost
2008 · Tzu-Ying Kuo, Shu-Ming Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Synthesis and characterization of molybdenum/phenolic resin composites binding with aluminum nitride particles for diamond cutters
2013 · Chun-Te Lin, Hsun-Tsing Lee, et al. · Applied Surface Science · 28
Relationship between job position, job attributes, and workplace friendship: Taiwan and China
2010 · Chun‐Te Lin · Journal of Technology Management in China · 28
Investigation of the hysteresis phenomenon of a silicon-based piezoresistive pressure sensor
2007 · Hsin-Nan Chiang, Tsung-Lin Chou, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 23
Process, assembly and electromigration characteristics of glass interposer for 3D integration
2014 · Chun-Hsien Chien, Ching-Kuan Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
Preparation of vanadium‐modified phenolic resin/modified zirconia composites and its applied properties in cubic boron nitride (cBN) grinding wheels
2015 · Chun‐Te Lin, Hsun‐Tsing Lee, et al. · Polymer Composites · 8
Small-scale Plumes From a Semi-enclosed Basin: Yin-Yang Bay
1994 · Chun-Te Lin, Kuang-Lung Fan, et al. · Terrestrial Atmospheric and Oceanic Sciences · 7
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A study of the relationship between job attribute and employee workplace friendship: Taiwan and Mainland China
2008 · Chun-Te Lin, An-Tien Hsieh, et al. · Portland International Conference on Management of Engineering and Technology (PICMET) · 6
Investigation of Thermal Effect of Packaged CMOS Compatible Pressure Sensor
2002 · Chih-Tang Peng, Ji-Cheng Lin, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 6
Analysis and validation of thermal and packaging effects of a piezoresistive pressure sensor
2004 · Chih‐Tang Peng, Ji‐Cheng Lin, et al. · Journal of the Chinese Institute of Engineers · 5
Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor
2003 · Chun-Te Lin, Chih-Tang Peng, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 5
Considerations of SiP based Antenna in Package/ Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications
2021 · Kuan-Hsun Wu, Hsi-Tseng Chou, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Wind Modulation of Small-scale Plumes From Yin-Yang Bay
1995 · Chun-Te Lin, Shenn-Yu Chao, et al. · Terrestrial Atmospheric and Oceanic Sciences · 4
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The relationship between enterprise strategy and employee workplace friendship: Taiwan and mainland China
2009 · Lin Chun-Te, Lu Chun-Ling · Portland International Conference on Management of Engineering and Technology (PICMET) · 3
Reliability analysis of flip chip packages using contact finite element method
2004 · Chun‐Te Lin, Kuo‐Ning Chiang · Journal of the Chinese Institute of Engineers · 3
Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process
2020 · Pin-Zhong Shen, Ding-Bing Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
The influence of workplace friendship on work values: Taiwan and China
2013 · Chun‐Te Lin, Chunling Lu · Portland International Conference on Management of Engineering and Technology (PICMET) · 2
Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging
2013 · Yen-Fu Su, Chun-Te Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Nano-scale and Atomistic-Scale Modeling of Advanced Materials
2021 · Ruo Li Dai, Wei-Hsin Liao, et al. · Springer eBooks · 1
Structure design and reliability assessment of double-sided with double-chip stacking packaging
2014 · Yen-Fu Su, Chun-Te Lin, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
The relationship between gender difference and employee workplace friendship: Taiwan and China
2010 · Chunling Lu, Chun‐Te Lin · Portland International Conference on Management of Engineering and Technology (PICMET) · 1
A New Nano-Probe Using Micro Assembly Transfer
2006 · Jen-yi Chen, Chun-te Lin, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Works count: 41
Citation count: 373
H-index: 8
I10-index: 8
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