Author

Chien-Min Lin

Observed name: Chien-min Lin

Institution: Advanced Semiconductor Engineering (Taiwan)

Observed institutions: National Taiwan University, Advanced Semiconductor Engineering (Taiwan), Taiwan Semiconductor Manufacturing Company (Taiwan)

ORCID: 0009-0003-0913-1090

Observed ORCID: 0009-0003-0913-1090

OpenAlex ID: A5102152617

Comparisons between serpentine and flat spiral delay lines on transient reflection/transmission waveforms and eye diagrams

2006 · Wei-Da Guo, Guang-Hwa Shiue, et al. · IEEE Transactions on Microwave Theory and Techniques · 53

Fast Methodology for Determining Eye Diagram Characteristics of Lossy Transmission Lines

2009 · Wei-Da Guo, Jeng-Hau Lin, et al. · IEEE Transactions on Advanced Packaging · 47

Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction

2008 · Kai-Bin Wu, Guang-Hwa Shiue, et al. · IEEE Transactions on Advanced Packaging · 46

Design of Reflectionless Vias Using Neural Network-Based Approach

2008 · Ku-Teng Hsu, Wei-Da Guo, et al. · IEEE Transactions on Advanced Packaging · 18

An Integrated Signal and Power Integrity Analysis for Signal Traces Through the Parallel Planes Using Hybrid Finite-Element and Finite-Difference Time-Domain Techniques

2007 · Wei-Da Guo, Guang-Hwa Shiue, et al. · IEEE Transactions on Advanced Packaging · 16

Optimized Signal and Power Integrity of Silicon Interposer for HBM2E in CoWoS Packaging

2024 · Kuei-Ju Lin, Chien-Min Lin, et al. · IEEE Transactions on Signal and Power Integrity · 11

Model Extractions of Coupled Bonding-wire Structures in Electronic Packaging

2006 · Hao-Geng Lin, Tian-Wei Huang, et al. · Asia-Pacific Microwave Conference (APMC) · 7

A 4-GHz universal high-frequency on-chip testing platform for IP validation

2014 · Ping-Lin Yang, Cheng-Chung Lin, et al. · IEEE VLSI Test Symposium (VTS) · 6

Reflectionless Design for Differential-Via Transitions Using Neural Network-Based Approach

2007 · Yung-Shou Jeng, Wei-Da Guo, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 5

Designs of signal-ground bump-patterns for minimizing the simultaneous switching noise in a ball grid array

2008 · Ruey-Bo Sun, Chien-Min Lin, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 4

Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections

2024 · Ju-Ching Chien, Chien-Min Lin, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 3

Fast Algorithm for Determining Eye-Diagram Characteristics of Lossy Transmission Lines

2007 · Jeng-Hau Lin, Wei-Da Guo, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 3

Investigation of Polyimide Cracking Effects in Wafer-Level Chip Scale Package on Substrate (WLCSPoS) During Component-Level and Board-Level Reliability Testing

2025 · Fa-Chuan Chen, Bo-Kuan Yeh, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2

High-Precision X-ray Inspection of Flip Chip Packaging Leveraging Deep Learning and Instance Segmentation for Manufacturing Process Optimization

2025 · Chien-Hung Yang, Wei-Tsung Tang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Solder Ball Alloy Effect on Board Level Reliability Thermal Cycling and Vibration Test Enhancement

2024 · Fa -Chuan Chen, Kevin Yu, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Agile Analysis for Worst-Case Eye-Diagrams in Multi-Line Links of CoWoS Packaging

2024 · Zhu-Chen Chang, Chien-Min Lin, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1

Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging

2024 · Cheng-Yuan Lu, Chien-Min Lin, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1

An Efficient and Flexible Modeling for Power/Ground Planes

2006 · Kai Bin Wu, Guang Hwa Shiue, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1

Trace-Element Effects in SAC Alloys: Mitigating HIP Defects in 5G/Automotive SoC SMT Assemblies

2026 · Tai-Yin Lin, Fa-Chuan Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC)

Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging

2025 · Fong-Rong Bai, Cheng-Yuan Lu, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Temperature-Dependent Eye-Height Prediction for HBM3E Links Using GPR Kernel Method

2025 · Ju-Ching Chien, Chien-Min Lin, et al. · IEEE journal on multiscale and multiphysics computational techniques

Combined FDTD/FETD algorithm for ground bounce characterization of differential traces through the planes

2006 · Wei-Da Guo, Guang-Hwa Shiue, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Works count: 22

Citation count: 226

H-index: 7

I10-index: 6