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Author

Hisanori Matsuo

Observed name: Hisanori MATSUO
Institution: Ebara (Japan)
OpenAlex ID: A5102544935
Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-kTwo-Dimensional Periodic Porous Silica Films
2004 · Hidenori Miyoshi, Hisanori Matsuo, et al. · Japanese Journal of Applied Physics · 47
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Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
2005 · Hidenori Miyoshi, Hisanori Matsuo, et al. · Japanese Journal of Applied Physics · 23
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Theoretical Investigation of Dielectric Constant and Elastic Modulus of Three-Dimensional Isotropic Porous Silica Films with Cubic and Disordered Pore Arrangements
2005 · Hidenori Miyoshi, Kazuhiro Yamada, et al. · Japanese Journal of Applied Physics · 17
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Visualization of Acoustic Waves and Cavitation in Ultrasonic Water Flow
2021 · Hidehisa Usui, Tomoatsu Ishibashi, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 13
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Influence of Slurry Chemistry on Frictional Force in Copper Chemical Mechanical Polishing
2005 · Akira Ishikawa, Hisanori Matsuo, et al. · Journal of The Electrochemical Society · 10
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Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
2004 · Hisanori Matsuo, Akira Ishikawa, et al. · Japanese Journal of Applied Physics · 10
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Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-k/Cu Interconnects
2007 · Jun Kawahara, Akinori Nakano, et al. · Japanese Journal of Applied Physics · 5
Optimal Injection Distance in Ultrasonic Water Flow Cleaning
2023 · Keita Ando, Riria Sakota, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
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Planarization profile modeling using pad bulk deformation and real contact area analysis of macro-scale device pattern
2023 · Seonho Jeong, Jongmin Jeong, et al. · Japanese Journal of Applied Physics · 3
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Effect of frictional force vector on delamination in Cu/low-k integration
2006 · Hisanori Matsuo, Seiichi Kondo, et al. · Microelectronic Engineering · 3
Parametric Studies on Particle Removal and Erosion in Nozzle Injection Megasonic Cleaning
2023 · Tomoatsu Ishibashi, Hisanori Matsuo, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 2
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Physical Simulation and Visualization of the Marangoni Convection inside Meniscus Region under IPA Vapor in Wafer Drying Process
2019 · Naoki Ono, Takashi Yamada, et al. · ECS Transactions · 2
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A Cu Electroplating Solution for Porous Low-k∕Cu Damascene Interconnects
2007 · Masashi Shimoyama, Shinichi Chikaki, et al. · Journal of The Electrochemical Society · 2
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Analysis of CMP planarization performance for STI process.
2001 · Manabu TSUJIMURA, Hisanori MATSUO, et al. · Journal of the Japan Society for Precision Engineering · 2
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The endpoint detection method using moiré pattern in CMP’s EPD system
2023 · Sho Takitani, Soma Yamamoto, et al. · Japanese Journal of Applied Physics · 1
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Study on evaluation method for polishing pad surface topography based on optical fourier transform
2014 · Panart Khajornrungruang, Keisuke Suzuki, et al. · International Conference on Planarization/CMP Technology (ICPT) · 1
In-situ Measurement of Friction Force during Cu Chemical Mechanical Polishing
2003 · Hisanori Matsuo, Akira Ishikawa, et al. · International Conference on Solid State Devices and Materials (SSDM) · 1
Physical Simulation and Visualization of the Marangoni Convection inside Meniscus Region under IPA Vapor in Wafer Drying Process
2019 · Naoki Ono, Takashi Yamada, et al. · ECS Meeting Abstracts
Surface Tension Measurement of Water Surface Under IPA Vapor and the Impact of Its Concentration Dependence on the Marangoni Convection in Wafer Drying Process
2019 · Shumpei Miura, Takashi Yamada, et al. · ECS Meeting Abstracts
Study on evaluation method for surface topography of polishing pad based on optical Fourier transform
2015 · Keisuke Suzuki, Takahiro Tajiri, et al.
10106 Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform
2015 · Takahiro TAJIRI, Keisuke SUZUKI, et al. · The Proceedings of Conference of Kanto Branch
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21211 Study on mechanism of polishing pad surface dressing
2013 · Tatsuya KOREZAWA, Keichi KIMURA, et al. · The Proceedings of Conference of Kanto Branch
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606 Study on dressing mechanism R)r the polishing pad surface
2012 · Tatsuya KOREZAWA, Keiichi Kimura, et al. · The Proceedings of Conference of Kyushu Branch
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Works count: 23
Citation count: 146
H-index: 6
I10-index: 6
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