Author

Honghui Zhang

Institutions: Zhoukou Normal University, Xinyang Vocational and Technical College

Observed institutions: Dongguan University of Technology, Zhoukou Normal University, Xinyang Vocational and Technical College

ORCID: 0000-0002-9711-6119

Observed ORCID: 0000-0002-9711-6119

OpenAlex ID: A5102719693

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

2023 · Honghui Zhang, Hongyan Xu, et al. · RSC Advances · 5

Preparation and performance study of high-temperature resistant joints using Cu@Ni@Sn transient liquid phase diffusion bonding materials

2025 · Honghui Zhang, Hongyan Xu, et al. · Welding in the World · 3

Y2Mg2Al2Ge2O12:Ni2+ phosphors capable of NIR-II emission with enhanced luminescent performance through Si4+ substitution

2025 · Yuanyuan Chen, Honghui Zhang, et al. · Ceramics International · 1

Semiconductor Sensor-Based Online Monitoring System for VOCs Unorganized Emission Discharge

2024 · Jun Yuan, Wenju Wang, et al. · International Conference on Energy, Power and Electrical Technology (ICEPET) · 1

VOCs Monitoring Device Using New Ceramic Semiconductor Sensors

2024 · Jun Yuan, Honghui Zhang · Environmental science and engineering

Works count: 5

Citation count: 10

H-index: 2

I10-index: