Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Chunming Zhou
Institution:
Harbin Institute of Technology
Observed institution:
Harbin Institute of Technology
ORCID:
0000-0003-3369-8970
Observed ORCID:
0000-0003-3369-8970
OpenAlex ID:
A5102831701
Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling
2021
·
Chunming Zhou
, Peng Zhou
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
Investigation of the Output Voltage of a Piezoresistive MEMS Pressure Sensor Using Finite Element Modelling
2024
·
Yuqing Xia
, Peng Zhou
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++
2022
·
Hao Ren
, Peng Zhou
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Show more works
View as search
Works count:
3
Citation count:
2
H-index:
1
I10-index:
Year
Topic
Type
