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Arjun Wadhwa

Observed names: A. Wadhwa, Wadhwa, Arjun
ORCID: 0000-0002-8026-5257
Observed ORCID: 0000-0002-8026-5257
OpenAlex ID: A5103054442
Wireless Resonant Circuits Printed Using Aerosol Jet Deposition for MRI Catheter Tracking
2019 · Caroline D. Jordan, Bradford R. H. Thorne, et al. · IEEE Transactions on Biomedical Engineering · 26
All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications
2024 · Arjun Wadhwa, Jaime Benavides Guerrero, et al. · Materials · 16
Flexible screen-printed SiC-based humidity sensors
2025 · Arjun Wadhwa, Alexandre Perrotton, et al. · Communications Engineering · 11
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Controlling the Optical and Electrical Properties of Perovskite Films and Enhancing Solar Cell Performance Using the Photonic Curing Process
2024 · Moulay Ahmed Slimani, Arjun Wadhwa, et al. · Nanomaterials · 7
Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications
2024 · Arjun Wadhwa, Mohammad Saadati, et al. · Materials · 4
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Reshaping surface dynamics in Kapton® substrate for advanced printed electronics: An investigation of intense pulsed light, laser and plasma treatments
2024 · M. H. Taherian, A. Wadhwa, et al. · MRS Advances · 3
Additive Fan-Out Packaging for Discrete Components
2025 · Edsger C. P. Smits, Arjun Wadhwa, et al. · IEEE CPMT Symposium Japan (ICSJ) · 2
Printed hybrid capacitive Kirigami sensor: enhancing flexibility and conformability for improved motion artifacts
2024 · Laura Morelli, Arjun Wadhwa, et al. · Flexible and Printed Electronics · 1
Advancing Panel-Level Fan-Out Technologies for High-Frequency and Power Devices through Alternative Through-Package Interconnects
2026 · Tindara Verduci, Arjun Wadhwa, et al. · IMAPSource Proceedings
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Additive Fan-Out Packaging for Discrete Components
2026 · Arjun Wadhwa, Edsger C. P. Smits, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Improving solder wettability atop screen-printed copper for flexible hybrid electronic circuit assembly
2025 · François-Xavier Fortier, Luis-Felipe Gerlein, et al. · Flexible and Printed Electronics
Improving run-time stability with aerosol jet printing using a solvent add-back bubbler
2023 · Wadhwa, Arjun, Cormier, Denis, et al. · Journal of Print and Media Technology Research
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Works count: 13
Citation count: 71
H-index: 4
I10-index: 3
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