Author

Kuo-Jung Lee

Institution: I-Shou University
Observed institution: I-Shou University
ORCID: 0000-0003-3494-2664
Observed ORCID: 0000-0003-3494-2664
OpenAlex ID: A5103120732
2012 · Kuo-Jung Lee, Chun-Hung Wu, et al. · Procedia Engineering · 10
2018 · Chih-Feng Wang, Pei-Rung Hung, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 5
2004 · Kuo-Jung Lee, Shi-Wei Lee · MATERIALS TRANSACTIONS · 2
2026 · Huei-Sen Wang, Chih-Chun Hsieh, et al. · Materials · 1
2018 · Chih-Feng Wang, Pei-Kang Huang, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 1
Works count: 22
Citation count: 236
H-index: 9
I10-index: 9
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