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Min‐Yan Tsai

An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging
2025 · Kuan-Ju Shao, Meng-Chun Chiu, et al. · Materials Science in Semiconductor Processing · 20
The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging
2021 · Chien-Lung Liang, Min-Yan Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
2024 · Meng-Chun Chiu, Min-Yan Tsai, et al. · Surface and Coatings Technology · 15
Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
2024 · Yen-Cheng Huang, Min-Yan Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration
2024 · Chien-Lung Liang, Yung-Sheng Lin, et al. · International Conference on Electronics Packaging (ICEP) · 7
Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages
2021 · Min-Yan Tsai, Yung-Sheng Lin, et al. · International Symposium on Microelectronics · 7
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Effect of Microstructure on the Electromigration Performance of 2- μm-Cu Redistribution Line under In-situ SEM Observation
2024 · Min-Yan Tsai, Ting-Chun Lin, et al. · IEEE CPMT Symposium Japan (ICSJ) · 6
An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
2023 · Min-Yan Tsai, Chin-Li Kao, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Microstructure and growth of Cu hillock on redistribution line under electromigration
2024 · Yen-Cheng Huang, Min-Yan Tsai, et al. · Journal of Materials Science Materials in Electronics · 3
Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on Reliability
2025 · Min-Yan Tsai, Shan-Bo Wang, et al. · IMAPSource Proceedings · 1
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Advanced Numerical Modeling of Microstructure Effect on Fine Cu Redistribution Lines Under Electric Current Stressing
2025 · Tai-Yu Pan, Min-Yan Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Electromigration Failure Study of Advanced Flip-chip QFN Solder Interconnects with Various Metallization Combinations for High-power Automobile Applications
2024 · Yu-Chun Liu, Shan-Bo Wang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Methodology for Fine Line Strength in Fan-Out Architectures
2026 · Yung-Sheng Lin, Ting-Chun Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Reliability Assessment of Hybrid Bonding Interconnects under Electromigration Stress
2026 · Min-Yan Tsai, Shan-Bo Wang, et al. · International Conference on Electronics Packaging (ICEP)
Multiobjective Optimization of Fingerprint Adversarial Examples Generation for Financial Technology Security Based on NSGA-IV
2026 · Min-Yan Tsai, Chi-Yuan Chen, et al. · IEEE Transactions on Computational Social Systems
Evaluating Adversarial Robustness in Remote Sensing Vision-Language Foundation Models for Zero-Shot Scene Classification
2026 · Yen-Chia Kuo, Yu-An Chen, et al. · IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing
Improving the Uniformity of Cu Deposition in Fanout Panel Level Package with FEM Simulation Model
2025 · Yi-Lun Hung, Yung-Sheng Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Predicted Cu Plating Thickness Distribution in Fan-Out Panel Level Package with Global/Local Model
2025 · Yi-Lun Hung, Yung-Sheng Lin, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out Packaging
2024 · Kuan-Ju Shao, Min-Yan Tsai, et al. · IMAPSource Proceedings
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Works count: 19
Citation count: 92
H-index: 6
I10-index: 3
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