Author

Jeroen van den Brand

Observed names: Jeroen Van Den Brand, Jeroen van Den Brand, van den Brand, Jeroen

Observed institutions: Netherlands Organisation for Applied Scientific Research, Ghent University, Holst Centre (Netherlands)

OpenAlex ID: A5103621233

Flexible and stretchable electronics for wearable health devices

2015 · Jeroen van den Brand, Margreet de Kok, et al. · Solid-State Electronics · 137

Large‐Area All‐Printed Temperature Sensing Surfaces Using Novel Composite Thermistor Materials

2018 · Dimitra Katerinopoulou, Peter Zalar, et al. · Advanced Electronic Materials · 99

PDF

Stretchable Circuits with Horseshoe Shaped Conductors Embedded in Elastic Polymers

2013 · Amir Jahanshahi, Mario Gonzalez, et al. · Japanese Journal of Applied Physics · 63

PDF

Stretchable and transparent electrodes based on patterned silver nanowires by laser-induced forward transfer for non-contacted printing techniques

2016 · Teppei Araki, Rajesh Mandamparambil, et al. · Nanotechnology · 57

4.5.2 Development of printed RFID sensor tags for smart food packaging

2012 · Edsger Smits, Jeroen Schram, et al. · Proceedings IMCS 2012 · 46

PDF

Flexible embedded circuitry: A novel process for high density, cost effective electronics

2009 · Jeroen van den Brand, Roel Kusters, et al. · Microelectronic Engineering · 32

Capillary self-alignment of mesoscopic foil components for sensor-systems-in-foil

2012 · Gari Arutinov, Edsger C P Smits, et al. · Journal of Micromechanics and Microengineering · 26

PDF

Screen‐Printed Dry Electrodes: Basic Characterization and Benchmarking

2020 · Peter Zalar, Milan Saalmink, et al. · Advanced Engineering Materials · 22

9.4: Stretchable 45 × 80 RGB LED Display Using Meander Wiring Technology

2015 · Hideki Ohmae, Yoshihiro Tomita, et al. · SID Symposium Digest of Technical Papers · 20

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

2010 · Jeroen van den Brand, Roel Kusters, et al. · Electronic System-Integration Technology Conference (ESTC) · 19

PDF

Critical Design Considerations for Longer-Term Wear and Comfort of On-Body Medical Devices

2024 · Shavini Stuart, Margreet de Kok, et al. · Bioengineering · 18

PDF

Photonic Flash Soldering of Thin Chips and SMD Components on Foils for Flexible Electronics

2014 · Daan A. van den Ende, Rob Hendriks, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 16

Flexible and stretchable electronics for wearable healthcare

2014 · Jeroen van den Brand, Margreet de Kok, et al. · European Solid-State Device Research Conference · 16

PDF

Flipchip bonding of thin Si dies onto PET foils: Possibilities and applications

2011 · van den Brand, Jeroen, Kusters, Roel, et al. · Ghent University Academic Bibliography (Ghent University) · 16

PDF

Fine printing method of silver nanowire electrodes with alignment and accumulation

2019 · Ashuya Takemoto, Teppei Araki, et al. · Nanotechnology · 15

PDF

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

2016 · Gari Arutinov, Rob Hendriks, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15

A conformable active matrix LED display

2015 · Ashutosh Tripathi, Edsger C. P. Smits, et al. · Ghent University Academic Bibliography (Ghent University) · 13

PDF

Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

2013 · Andrés Vásquez Quintero, Bart van Remoortere, et al. · Microelectronic Engineering · 11

System-in-Foil Technology

2010 · Andreas Dietzel, Jeroen van den Brand, et al. · Springer eBooks · 11

Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

2013 · Péter, Mária, van den Ende, Daan, et al. · Ghent University Academic Bibliography (Ghent University) · 10

High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

2013 · van den Ende, Daan, Verhoeven, Frits, et al. · Ghent University Academic Bibliography (Ghent University) · 10

Novel lamination and interconnection technologies demonstrated in a flexible modular optical sensor array for wound monitoring

2009 · Jeroen van den Brand, Milan Saalmink, et al. · Microelectronic Engineering · 10

Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications

2015 · Ashok Sridhar, Sandeep M. Perinchery, et al. · Microelectronics Reliability · 7

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

2012 · Maarten Cauwe, Bjorn Vandecasteele, et al. · Electronic System-Integration Technology Conference (ESTC) · 7

PDF

49‐2: Invited Paper : Stretchable Passive Matrix LED Display with Thin‐Film Based Interconnects

2016 · Rik Verplancke, Maarten Cauwe, et al. · SID Symposium Digest of Technical Papers · 6

Works count: 49

Citation count: 731

H-index: 15

I10-index: 22