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Po-Chih Pan

Observed names: Pan Po-Chih, Po Chih Pan
OpenAlex ID: A5103710789
Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications
2017 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Improving high-speed signal transmission loss by low conductor surface roughness
2015 · Ming-Fong Jhong, Po-Chih Pan, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13
Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules
2015 · Cheng-Yu Ho, Hung-Hsiang Cheng, et al. · IEEE Transactions on Microwave Theory and Techniques · 12
Antenna array integrated on multilayer organic package for millimeter-wave applications
2016 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Extraction of Complex Permittivity of Dielectrics on Package from W-band to D-band
2021 · Yi-Ting Lin, Hung-Chun Kuo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Electrical, thermal and warpage investigation on high bandwidth PoP
2013 · Mike Hung, Chang-Chi Lee, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Technology Enhancements on Focos-Bridge for Emerging Trends in High-Performance Computing (HPC) and Artificial Intelligence (AI)
2025 · Teck Chong Lee, Chung Hao Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last
2018 · Chih-Yi Huang, Tsun-Lung Hsieh, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Millimeter-wave antenna in package on low-cost organic substrate for flip chip chip scale (FCCSP) package
2017 · Cheng-Yu Ho, Sheng-Chi Hsieh, et al. · IEEE CPMT Symposium Japan (ICSJ) · 4
Antenna-on-package on low-cost organic substrate for 60 GHz wireless communication applications
2017 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
The Comparison of Package Design and Electrical Analysis in Mobile Application
2017 · Tsun-Lung Hsieh, Yuan-Hsi Chou, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Signal Integrity Analysis of UCIe Channel in FOCoS Advanced Package
2024 · Chiung-Ying Kuo, Po-Chih Pan, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3
Next generation package-on-package solution to support wide IO and high bandwidth interface
2014 · Hung-Hsiang Cheng, Chang-Chi Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
High bandwidth application with Wide I/O memory on 2.5D-IC silicon interposer
2013 · Chen-Chao Wang, Hung-Hsiang Cheng, et al. · IEEE CPMT Symposium Japan (ICSJ) · 3
Design and characterization of power delivery system for multi-chip package with embedded discrete capacitors
2011 · Hung-Hsiang Cheng, Chih-Wen Kuo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Design and electrical analysis for adavanced fan-out package-on-package
2017 · Po-Chih Pan, Tsun-Lung Hsieh, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
Scalable Modeling and Measurement of TSV Applied for Efficiency Improvement of a RF PA
2016 · Ming-Fong Jhong, Cheng-Yu Ho, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
High bandwidth application on 2.5D IC silicon interposer
2014 · Chen-Chao Wang, Hung-Hsiang Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Hybrid RDL Design in Fan-out Package
2021 · Ming-Fong Jhong, Po-I Wu, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages
2015 · Cheng-Yu Ho, Hung-Hsiang Cheng, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 1
Multi-physics Design Methodology for Enlarged Chiplets Interconnections in Advanced Packaging
2026 · Yung-Sheng Lin, Chih-Yi Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Worst Eye Performance Analysis for Advanced Package Die-to-Die Interconnects
2025 · Hung-Chun Kuo, Po-Chih Pan, et al. · IEEE Workshop on Signal and Power Integrity
Electrical Performance Analysis for Bridge Die Package Solution
2022 · Po Chih Pan, Fu Cheng Chu, et al. · International Conference on Electronics Packaging (ICEP)
A planar High-efficient W-band Substrate-Integrated-Waveguide Cavity-backed Slot Antenna Array
2022 · Yi-Ting Lin, Hung-Chun Kuo, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Ultra-slim package design for millimeter wave application
2018 · Ming-Fong Jhong, Chung-Hsiung Ho, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Works count: 28
Citation count: 106
H-index: 6
I10-index: 3
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