Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Hung-Shyong Chen
Institution:
Cheng Shiu University
Observed institution:
Cheng Shiu University
OpenAlex ID:
A5104228332
The static and fatigue strength of bolted joints in composites with hygrothermal cycling
2001
·
Hung-Shyong Chen
·
Composite Structures
·
42
A method to determine the sweep resistance of wire bonds for microelectronic packaging
2008
·
Huang-Kuang Kung
, Yun-Ping Sun
, et al.
·
Microelectronic Engineering
·
26
Applying a Neural Network to Predict Surface Roughness and Machining Accuracy in the Milling of SUS304
2023
·
Ming-Hsu Tsai
, Jeng-Nan Lee
, et al.
·
Electronics
·
24
PDF
Effects of Marginal Bone Loss Progression on Stress Distribution in Different Implant–Abutment Connections and Abutment Materials: A 3D Finite Element Analysis Study
2022
·
Ching-Ping Lin
, Yi-Ting Shyu
, et al.
·
Materials
·
15
PDF
Biomechanical Analysis of Titanium Dental Implants in the All-on-4 Treatment with Different Implant–Abutment Connections: A Three-Dimensional Finite Element Study
2023
·
Pei-Shuang Wang
, Ming-Hsu Tsai
, et al.
·
Journal of Functional Biomaterials
·
14
PDF
Biomechanical effects of original equipment manufacturer and aftermarket abutment screws in zirconia abutment on dental implant assembly
2020
·
Yu-Ling Wu
, Ming-Hsu Tsai
, et al.
·
Scientific Reports
·
13
PDF
Reverse Torque Value of Angulated Screw Channel Abutment before and after Cyclic Loading: An In Vitro Study
2023
·
Yu-Hsuan Chen
, Yu-Ling Wu
, et al.
·
Journal of Functional Biomaterials
·
11
PDF
Comparing the Fracture Resistance and Modes of Failure in Different Types of CAD/CAM Zirconia Abutments with Internal Hexagonal Implants: An In Vitro Study
2022
·
Yu-Tsen Chang
, Yu-Ling Wu
, et al.
·
Materials
·
11
PDF
The wire sag problem in wire bonding technology for semiconductor packaging
2012
·
Huang-Kuang Kung
, Hung-Shyong Chen
, et al.
·
Microelectronics Reliability
·
11
The equivalent diameter of copper wire and gold wire based on the sweep stiffness evaluation in semiconductor packaging
2009
·
Huang-Kuang Kung
, Hung-Shyong Chen
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
11
A Biomechanical Evaluation of Distal Tilting Implants in All-on-Four Rehabilitation with Mild Mandibular Resorption: A Finite Element Analysis Study
2024
·
Ming-Hsu Tsai
, Chung-Han Lee
, et al.
·
Materials
·
5
The Effect of an Er, Cr: YSGG Laser Combined with Implantoplasty Treatment on Implant Surface Roughness and Morphologic Analysis: A Pilot In Vitro Study
2022
·
Chih-Jen Lin
, Ming-Hsu Tsai
, et al.
·
Journal of Functional Biomaterials
·
5
PDF
The Improvement of Sweep Stiffness and Thermomechanical Properties of Wire Bonds for Pure Gold Wire with Dopant
2007
·
Huang-Kuang Kung
, Hung-Shyong Chen
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Electrochromic Properties of LiWO3 Thin Films Prepared by Electron Beam Evaporation
2023
·
Chien-Chung Hsu
, Chih-Ming Wang
, et al.
·
IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE)
·
1
Geometric Modelling and Multi-Axis NC Machining for the Femoral Component of Knee Prosthesis
2012
·
Jeng-Nan Lee
, Hung-Shyong Chen
, et al.
·
Advanced Science Letters
·
1
Effect of Marginal Bone Integrity and Aftermarket Abutment Screws on Dental Implant Systems—A Preliminary Study with Finite Element Method
2022
·
Yu-Ling Wu
, Ming-Hsu Tsai
, et al.
·
Materials
PDF
The Effect of Flow Pulsation on Ultrafiltration System Limiting Flux Behavior
2013
·
Chyouhwu Brian Huang
, Hung-Shyong Chen
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
Heat Insulating Materials Thermal Conductivity Determination by Means of Comparison With a Standard Plate of Known Conductivity
2012
·
Chyouhwu Brian Huang
, Hung-Shyong Chen
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
Toolpath Generation and Error Analysis for Five-Axis NC Machining of Spatial Cam
2012
·
Jeng-Nan Lee
, Hung-Shyong Chen
, et al.
·
Advanced Science Letters
The Application of Arc Spraying to the Hard Facing of Wear-Resistant Multi-Layer Plate
2012
·
Hung-Shyong Chen
, Jeng-Nan Lee
, et al.
·
Advanced Science Letters
The Critical Dimension Definition of Femoral for Custom-made Total Knee Arthroplasty by the Application of Geometric Modeling
2012
·
Hung-Shyong Chen
, Tsai Yau Bin
, et al.
The Profile Design and Multi-Axis NC Machining of Cylindrical Cam with Boat-Shape Follower
2011
·
Jeng-Nan Lee
, Hung-Shyong Chen
, et al.
·
Advanced Science Letters
The Effect of Porous Material on the Improvement of the Micro-Chip Heat Dissipation
2008
·
Chyouhwu B. Huang
, Hung-Shyong Chen
, et al.
·
ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B
Effects of Microcracks and Surface Roughness on Thermal Oxidation of Carbon-Fiber Reinforced Polyimide Composite
2004
·
Huang-Kuang Kung
, Hung-Shyong Chen
·
Elsevier eBooks
Show more works
View as search
Works count:
24
Citation count:
192
H-index:
10
I10-index:
10
Year
Topic
Type