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Author

Joelle Arnold

Observed institution: DfR Solutions (United States)
OpenAlex ID: A5108204204
Second Generation Pb-Free Alloys
2010 · Randy Schueller, Nathan Blattau, et al. · Journal of Surface Mount Technology · 16
A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
2014 · Stephani Gulbrandsen, Joelle Arnold, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 12
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Comparison of Aluminum Electrolytic Capacitor Lifetimes Using Accelerated Life Testing
2014 · Stephani Gulbrandsen, Joelle Arnold, et al. · IMAPSource Proceedings · 4
iNEMI Pb-free alloy characterization project report: Thermal fatigue results for low and no-Ag alloys
2012 · Gregory Henshall, Keith Sweatman, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3
Gold Embrittlement in Lead-Free Solder
2014 · Craig Hillman, Nathan Blattau, et al. · Regional Events · 1
iNEMI Pb-Free Alloy Characterization Project Report: Part IV - Effect of Isothermal Preconditioning on Thermal Fatigue Life
2012 · Richard Coyle, Richard Parker, et al. · SMTA International · 1
Silver and Sulfur: Case Studies, Physics, and Possible Solutions
2007 · Craig Hillman, Joelle Arnold, et al. · SMTA International · 1
Impact of Process Control in Pb-free to SnPb Reballing Techniques - Part II: Contamination and Cleaning
2014 · Joelle Arnold · Cleaning and Coating Conference
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
2014 · Joelle Arnold, Steph Gulbrandsen, et al. · IMAPSource Proceedings
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Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1: Control of Thermal Exposure
2014 · Joelle Arnold, Seth Binfield, et al. · Soldering and Reliability Conferences
Inemi PB-Free Alloy Characterization Project Report: Part V – The Effect of Dwell Time on Thermal Fatigue Reliability
2013 · Richard Coyle, Richard Parker, et al. · SMTA International
iNEMI Pb-Free Alloy Characterization Project Report: Part III - Thermal Fatigue Results for Low-AG Alloys
2012 · Keith Sweatman, Keith Howell, et al. · SMTA International
Inemi Pb-Free Alloy Characterization Project Report: Part I – Program Goals, Experimental Structure, Alloy Characterization, and Test Protocols for Accelerated Thermal Cycling
2012 · Gregory Henshall, Jian Miremadi, et al. · SMTA International
The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications
2011 · Greg Caswell, Joelle Arnold · IMAPSource Proceedings
Reliability Testing of Ni-Modified SnCu and SAC305 – Accelerated Thermal Cycling
2008 · Joelle Arnold, Nathan Blattau, et al. · SMTA International
Reliability Testing of Ni-Modified SnCu and SAC305 – Vibration
2008 · Joelle Arnold, Keith Sweatman · SMTA International
Moisture Sensitive Device (MSD) Controls for Printed Wiring Boards (PWBs)
2008 · Joelle Arnold, Mumtaz Bora · On-Demand Webinars
Epidemiological Study on Sn-Ag-Cu Solder: Benchmarking Results from Accelerated Life Testing
2006 · Craig Hillman, Nathan Blattau, et al. · SMTA International
Rapid Power Cycling of Pb-Free Soldered Components
2006 · Nathan Blattau, Danko Priimak, et al. · SMTA International
Works count: 19
Citation count: 38
H-index: 3
I10-index: 2
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