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Author

Chin-Pin Hung

ORCID: 0000-0001-9023-3999
Observed ORCID: 0000-0001-9023-3999
OpenAlex ID: A5108322239
Thermal resistance prediction model for IC packaging optimization and design cycle reduction
2024 · Guan-Wei Chen, Yan-Cheng Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
A Novel Detection Applied on Micro Defect in Bump Interface for 2.5DIC Package
2024 · Yi-Sheng Lin, Yu-Hsiang Hsiao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation
2024 · Jui-Cheng Yu, Chien-Neng Liao, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
Warpage characterization analysis for Embedded package technology
2016 · Tang-Yuan Chen, Meng-Kai Shih, et al. · International Conference on Electronics Packaging (ICEP) · 2
Investigation into the Impact of Layout Design on Thermal Performance in Embedded-Die Packages
2024 · Tang-Yuan Chen, Dao-Long Chen, et al. · International Conference on Electronics Packaging (ICEP) · 1
Synergistic Additive Formulation and Electrochemical Analysis for Copper Grain Refinement in Advanced Semiconductor Packaging
2026 · Rui-Zhe Wu, Tzu-Hsing Chiang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Enhanced Fault Localization Approach for Advanced Packaging with RDL Interconnection Nano-Defects
2026 · Yi-Sheng Lin, Wiwy Wudjud, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Pressure-less Cu/Polymer Hybrid Bonding at Low Temperature and Fine Pitch using a Novel Polymer Adhesive with Precisely Controlled Composition
2026 · Ryo Hayakawa, Yuzo Nakamura, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Methodology for Fine Line Strength in Fan-Out Architectures
2026 · Yung-Sheng Lin, Ting-Chun Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
An Innovative Automated Tracing Method for Defect Identification in Advanced FOCoS-Bridge Package
2026 · Cheng-Hsin Liu, Yi-Sheng Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Improving the Uniformity of Cu Deposition in Fanout Panel Level Package with FEM Simulation Model
2025 · Yi-Lun Hung, Yung-Sheng Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Predicted Cu Plating Thickness Distribution in Fan-Out Panel Level Package with Global/Local Model
2025 · Yi-Lun Hung, Yung-Sheng Lin, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Works count: 12
Citation count: 13
H-index: 2
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