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Hirobumi Watanabe
Observed name:
Hirobumi WATANABE
Observed institutions:
Ricoh (Japan),
Columbia University Irving Medical Center,
Asahi Intecc (Japan),
New York University,
Columbia University
OpenAlex ID:
A5108702199
In-vitro perforation of the round window membrane via direct 3-D printed microneedles
2018
·
Aykut Aksit
, Daniel N. Arteaga
, et al.
·
Biomedical Microdevices
·
73
Microperforations Significantly Enhance Diffusion Across Round Window Membrane
2014
·
Catherine M. Kelso
, Hirobumi Watanabe
, et al.
·
Otology & Neurotology
·
50
Intravascular neural interface with nanowire electrode
2009
·
Hirobumi Watanabe
, Hirokazu Takahashi
, et al.
·
Electronics and Communications in Japan
·
38
A dual wedge microneedle for sampling of perilymph solution via round window membrane
2016
·
Hirobumi Watanabe
, Luis Cardoso
, et al.
·
Biomedical Microdevices
·
24
Human cochlear hydrodynamics: A high-resolution μCT-based finite element study
2016
·
Annalisa De Paolis
, Hirobumi Watanabe
, et al.
·
Journal of Biomechanics
·
23
Silver/silver chloride microneedles can detect penetration through the round window membrane
2015
·
Joseph M. Wazen
, James P. Stevens
, et al.
·
Journal of Biomedical Materials Research Part B Applied Biomaterials
·
22
Serrated needle design facilitates precise round window membrane perforation
2016
·
James P. Stevens
, Hirobumi Watanabe
, et al.
·
Journal of Biomedical Materials Research Part A
·
21
Microanatomic Analysis of the Round Window Membrane by White Light Interferometry and Microcomputed Tomography for Mechanical Amplification
2014
·
Hirobumi Watanabe
, Jeffrey W. Kysar
, et al.
·
Otology & Neurotology
·
20
Evaluation of Packaging-Induced Performance Change for Small-Scale Analog IC
2009
·
Naohiro Ueda
, Eri Nishiyama
, et al.
·
IEEE Transactions on Semiconductor Manufacturing
·
7
Ultra-Low Quiescent Current LDO with FVF-Based Load Transient Enhanced Circuit
2020
·
Kenji MII
, Akihito NAGAHAMA
, et al.
·
IEICE Transactions on Electronics
·
6
PDF
Analysis of RF Noise in LDO and Establishment of Noise Immunity
2019
·
Takahiro Hino
, Hirobumi Watanabe
·
International Symposium on Electromagnetic Compatibility - EMC Europe (EMC Europe)
·
4
In Situ NANO-Indentation of Round Window Membrane
2015
·
Hirobumi Watanabe
, Anil K. Lalwani
, et al.
·
Conference proceedings of the Society for Experimental Mechanics
·
4
Abstract WP195: The Impact of Tortuosity on Microwire Torquability
2024
·
Amir M Molaie
, Kenichi Sakuta
, et al.
·
Stroke
·
1
1/f Noise Characterizing Method of MOSFET Devices and Processes by the Power Spectral Density Integrated Method
2022
·
Yoshiki Murayama
, Masato Kijima
, et al.
·
IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)
·
1
Characterization of Packaging‐Induced Stress Distributions for Small‐Scale Silicon Chips
2020
·
Naohiro Ueda
, Hirobumi Watanabe
·
IEEJ Transactions on Electrical and Electronic Engineering
·
1
Impact of Local Stress Distribution in a Silicon Chip Mounted by Area-Arrayed Copper Pillar Wafer-Level Packaging Technology on Analog-Circuit Performance
2019
·
Naohiro Ueda
, Hirobumi Watanabe
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
1
PDF
Non-Linear DC Offset of LDO Due to RF Noise
2018
·
Takahiro Hino
, Hirobumi Watanabe
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
1
Grain Boundary Properties of Boron-Doped Polycrystalline Si1-XGeXResistors with Small Process Fluctuation and Small Drift for High Precision Analog ICs
2003
·
Hirobumi Watanabe
, Mitsuhiro Tamura
, et al.
·
Japanese Journal of Applied Physics
·
1
Quantitative Evaluation of RTN Associated with Extended LDD Structures in MOSFETs Using the Power Spectral Density Integration (PSDI) Method
2026
·
Yoshiki MURAYAMA
, Hirobumi WATANABE
·
IEICE Transactions on Electronics
PDF
Characterization of larger-single-Lorentzian noise deviated from 1/f characteristics detected by a power-spectral-density-integration method
2024
·
Yoshiki Murayama
, Masato Kijima
, et al.
·
Japanese Journal of Applied Physics
PDF
Post-Packaging Simulation Based on MOSFET Characteristics Variations Due to Resin-Molded Encapsulation
2020
·
Naohiro UEDA
, Hirobumi WATANABE
·
IEICE Transactions on Electronics
PDF
Evaluation of dynamic bonding stress and interlayer cracking using a combo sensor
2012
·
Yoshihiko Miki
, Hirobumi Watanabe
·
IEEE International Conference on Microelectronic Test Structures (ICMTS)
Design and Implementation of a WiMAX Analyzer
2011
·
Tashi Phuntsho
, Chihiro Hirata
, et al.
·
電子情報通信学会技術研究報告. IN, 情報ネットワーク
Design and implementation of a WiMAX analyzer (情報ネットワーク)
2011
·
Tashi Phuntsho
, Chihiro Hirata
, et al.
·
電子情報通信学会技術研究報告. IN, 情報ネットワーク
Multi-hop Streaming Delivery Method on Bluetooth
2009
·
Horie Yugo
, Chihiro Hirata
, et al.
·
IEICE Technical Report; IEICE Tech. Rep.
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Works count:
29
Citation count:
298
H-index:
8
I10-index:
8
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