Get started
Author

Takukazu Otsuka

Institution: ROHM
OpenAlex ID: A5108721248
Tensile mechanical properties of sintered porous silver films and their dependence on porosity
2019 · Keisuke Wakamoto, Yo Mochizuki, et al. · Japanese Journal of Applied Physics · 38
Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film
2020 · Keisuke Wakamoto, Yo Mochizuki, et al. · Materials · 34
PDF
Development of SiC diodes, power MOSFETs and intelligent power modules
2009 · Takashi Nakamura, Mineo Miura, et al. · physica status solidi (a) · 34
Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing
2023 · Keisuke Wakamoto, Takukazu Otsuka, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 33
Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test
2021 · Keisuke Wakamoto, Takukazu Otsuka, et al. · Energies · 29
PDF
Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading
2024 · Keisuke Wakamoto, Daisuke Yasugi, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 23
Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test
2022 · Keisuke Wakamoto, Yuga Kumakiri, et al. · Japanese Journal of Applied Physics · 17
PDF
Development of latent images due to transient free carrier electrons by femtosecond laser pulses and its application to grating shape trimming
2007 · Ken-ichi Kawamura, Takukazu Otsuka, et al. · Applied Physics Letters · 4
The Influence of Mechanical Property on the Heat-Cycle Reliability of Sintered Silver Die Attach
2020 · Keisuke Wakamoto, Yo Mochizuki, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 2
Stacked resin structure for reducing warpage of transfer-molded modules
2017 · Seita Iwahashi, Takukazu Otsuka, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 2
High Current (>1000A), High Temperature (>200°C) Silicon Carbide Trench MOSFET (TMOS) Power Modules for High Performance Systems
2012 · Brice R. McPherson, Robert Shaw, et al. · SAE International journal of passenger cars. Electronic and electrical systems · 2
Evaluating Sintered Silver Die-attach Thermal Cycling Degradation by Nine Point Cycling Bending Test
2022 · Keisuke Wakamoto, Takukazu Otsuka, et al. · International Conference on Solid State Devices and Materials (SSDM) · 1
(Tensile Mechanical Fatigue Properties of Sintered Porous Silver Films)
2019 · Keisuke Wakamoto, Yo Mochizuki, et al. · The Proceedings of Mechanical Engineering Congress Japan · 1
SiC Trench Devices with Ultra Low Ron
2013 · Takashi Nakamura, Masatoshi Aketa, et al. · ECS Transactions · 1
PDF
Reliability of Full-Face Diffusion Bonding with AG Coated AL Foil under Thermal Stress
2024 · Oji Sato, Takukazu Otsuka, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach
2024 · Keisuke Wakamoto, Takukazu Otsuka, et al. · Electronic System-Integration Technology Conference (ESTC)
R&D Bridging over Device and System Engineers Through the Electric-Mileage Estimation of a Motor System
2022 · Ken Nakahara, Hirokatsu Umegami, et al. · International Power Electronics Conference (IPEC)
Sintered Silver Die Degradation Evaluation by Nine Point Bending Test Technique
2022 · Keisuke Wakamoto, Takukazu Otsuka, et al. · The Proceedings of Mechanical Engineering Congress Japan
Micro pore structure dependence on pressured-type sintered silver tensile mechanical properties
2021 · Keisuke Wakamoto, Takukazu Otsuka, et al. · The Proceedings of Mechanical Engineering Congress Japan
Porosity Dependence of Tensile Mechanical Properties of Sintered Nanosilver Thin Films
2019 · Yo Mochizuki, Keisuke Wakamoto, et al. · The Proceedings of Conference of Tokai Branch
Influence of Porosity on Tensile Mechanical Properties of Sintered Nanosilver thin Films
2018 · Yo Mochizuki, Keisuke Wakamoto, et al. · The Proceedings of the Symposium on Micro-Nano Science and Technology
Tensile Mechanical Properties of Sintered Porous Silver Films
2018 · Keisuke Wakamoto, Yo Mochizuki, et al. · The Proceedings of Mechanical Engineering Congress Japan
High Performance SiC Power Devices and Modules -- Miniaturization of System by Low-Ron and High Temperature Operation
2012 · Takashi Nakamura, Masatoshi Aketa, et al. · IEICE Technical Report; IEICE Tech. Rep.
Development of SiC Diodes, Power MOSFETs and Intelligent Power Modules
2009 · Takashi Nakamura, Mineo Miura, et al. · Wiley eBooks
Nano-processing by interfered femtosecond laser pulse in transparent materials and control of photosensitivity by pre-pulse irradiation
2004 · Takukazu Otsuka, Kenichi Kawamura, et al. · 日本セラミックス協会年会講演予稿集(CD-ROM)
Works count: 25
Citation count: 221
H-index: 7
I10-index: 7
Year
Topic
Type