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Ting-Kan Tsai
Institution:
National Formosa University
Observed institutions:
National Yang Ming Chiao Tung University,
National Formosa University
ORCID:
0000-0001-9117-7968
Observed ORCID:
0000-0001-9117-7968
OpenAlex ID:
A5108782988
The growth morphology and crystallinity of electroless NiP deposition on silicon
2004
·
Ting-Kan Tsai
, Chuen-Guang Chao
·
Applied Surface Science
·
54
Growth and field emission of carbon nanofibers on electroless Ni–P alloy catalyst
2003
·
Ting-Kan Tsai
, Chia-Chih Chuang
, et al.
·
Diamond and Related Materials
·
38
Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition
2009
·
Wei-Hsiang Luo
, Ting-Kan Tsai
, et al.
·
Journal of Electronic Materials
·
15
Growth behavior of electroless copper on silicon substrate
2007
·
Shin-Shyan Wu
, Wei-Long Liu
, et al.
·
International Journal of Minerals Metallurgy and Materials
·
9
Enhancement of breakdown strength and electromigration reliability for cobalt lines lightly doped with boron
2022
·
Ting-Kan Tsai
, I-Ting Shih
, et al.
·
Materials Chemistry and Physics
·
8
Tribological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication
2007
·
Wei-Long Liu
, Shu-Hue Hsieh
, et al.
·
International Journal of Minerals Metallurgy and Materials
·
5
Interface structure between epitaxial NiSi2 and Si
2006
·
Wei-Long Liu
, Wen-Jauh Chen
, et al.
·
International Journal of Minerals Metallurgy and Materials
·
2
Formation and thickness-dependent resistivity scaling of C54-TiSi2, CoSi2, and NiSi thin films
2026
·
Yi-Yen Chen
, Guan-Ting Liu
, et al.
·
Journal of Alloys and Compounds
·
1
Ultra-trace Sc alloying enables highly thermally stable Cu thin films through interfacial stabilization
2026
·
Yi-Yen Chen
, Ying-Ning Lin
, et al.
·
Vacuum
Mixed-Potential-Driven Deposition of Cu Films with Dilute Co Incorporation for Enhanced Thermal and Electrical Reliability of Interconnects
2026
·
Jau-Shiung Fang
, Po-Chun Chen
, et al.
·
Journal of The Electrochemical Society
Mitigation of electromigration of Co interconnects through bamboo structure formation by miscible Ni incorporation
2026
·
Jau-Shiung Fang
, Chih-I Lin
, et al.
·
Thin Solid Films
Growth Behavior of Electroless Ni-Co-P Deposits on Silicon
2007
·
Wen Jauh Chen
, Wei-Long Liu
, et al.
·
ECS Meeting Abstracts
PDF
Growth of NiSi Nanowires by Electroless Nickel Plating on Silicon Nanowires
2007
·
Wen Jauh Chen
, Wei-Long Liu
, et al.
·
ECS Meeting Abstracts
PDF
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Works count:
13
Citation count:
132
H-index:
5
I10-index:
3
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