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Runsheng Mao
Observed names:
RUNSHENG MAO,
Run-Sheng Mao,
RunSheng Mao
Institution:
Tongji University
Observed institutions:
Tongji University,
Chinese Academy of Sciences,
Indium Corporation (United States),
Guangzhou Chemistry (China),
University of Salford,
Washington State University
show all 6
OpenAlex ID:
A5109214299
Rancidity of Walnuts and Almonds Affected by Short Time Heat Treatments for Insect Control
2003
·
ATHISAYA BURANSOMPOB
, JUMING TANG
, et al.
·
Journal of Food Processing and Preservation
·
74
PDF
A new linear method to calculate monomer reactivity ratios by using high conversion copolymerization data: terminal model
1993
·
Runsheng Mao
, Malcolm B. Huglin
·
Polymer
·
69
Reactivity ratios in copolymerizations involving allyl methacrylate
1996
·
Yan Liu
, Runsheng Mao
, et al.
·
Polymer
·
28
Texture Properties of Gellan Gels as Affected by Temperature
1999
·
RUNSHENG MAO
, JUMING TANG
, et al.
·
Journal of Texture Studies
·
17
Predicting strength of a unidirectional composite containing interface crack
2021
·
Run-Sheng Mao
, Zheng-Ming Huang
, et al.
·
Composites Science and Technology
·
14
Quantitative analysis of copolymers by FTIR
1993
·
Runsheng Mao
, Malcolm B. Huglin
, et al.
·
European Polymer Journal
·
14
Determination of Monomer Reactivity Ratios in the Crosslinking Copolymerization of Methyl Methacrylate with Ethylene Dimethacrylate
1995
·
Runsheng Mao
, Yan Liu
, et al.
·
Macromolecules
·
12
EFECT OF pH BUFFERS ON MECHANICAL PROPERTIES OF GELLAN GELS
1999
·
RUNSHENG MAO
, JUMING TANG
, et al.
·
Journal of Texture Studies
·
11
A new linear method to calculate monomer reactivity ratios by using high-conversion copolymerization data: penultimate model with r2=0
1994
·
Runsheng Mao
, Malcolm B. Huglin
·
Polymer
·
11
Characteristics of copolymerizations involving dimethylacrylamide and swelling behaviour of the copolymers in water
1996
·
Yan Liu
, Malcolm B. Huglin
, et al.
·
Polymer
·
9
Reactivity ratios for new copolymerizations relevant to thermosetting resins
1993
·
Runsheng Mao
, Malcolm B. Huglin
, et al.
·
Polymer International
·
9
Dynamic light scattering from polymer gels: spring-rotor model
1998
·
Runsheng Mao
, Yan Liu
, et al.
·
Polymer International
·
8
Fluxes With Decreased Viscosity After Reflow for Flip-chip and Sip Assembly
2019
·
Runsheng Mao
, Fen Chen
, et al.
·
IMAPSource Proceedings
·
3
Some aspects of the copolymerization of glyceryl methacrylate with methyl methacrylate
1995
·
Yan Liu
, Runsheng Mao
, et al.
·
Polymer
·
3
Reliability and Corrosion Resistance of High Temperature Lead-Free BiAgX™ Paste
2014
·
HongWen Zhang
, RunSheng Mao
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
2
Synthesis of Hydroxypropyl Cellulose Acetate and Properties of Reverse Osmosis Membranes
1991
·
Jicai Huang
, Runsheng Mao
, et al.
·
Chinese Journal of Applied Chemistry
·
2
iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components
2009
·
Shouk
, Rita Mohanty
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Network parameters and scaling behaviour of chemically crosslinked hydrogels of poly[(N,N‐dimethylacrylamide)‐co‐(methyl methacrylate)]
1997
·
Yan Liu
, Runsheng Mao
, et al.
·
Macromolecular Chemistry and Physics
·
1
Versatile TIM Solution with Chain Network Solder Composite
2020
·
Runsheng Mao
, Sihai Chen
, et al.
·
IMAPSource Proceedings
Versatile TIM Solution with Chain Network Solder Composite
2020
·
Runsheng Mao
, Sihai Chen
, et al.
·
SMTA International
Versatile TIM Solution with Chain Network Solder Composite
2020
·
Runsheng Mao
, Sihai Chen
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Complicated Board Programming for Automated Printed Solder Paste Inspection without Cad Data File
2014
·
Run-Sheng Mao
, Ning-Cheng Lee
·
SMTA International
Complicated Board Programming for KOH Young SPI Without CAD Data File
2014
·
Run-Sheng Mao
, Ning-Cheng Lee
·
Regional Events
Corrosion Resistance of High Temperature Lead-Free Biagx™ Paste
2013
·
HongWen Zhang
, RunSheng Mao
, et al.
·
SMTA International
iNEMI Solder Paste Deposition Project report — Optimizing solder paste printing for large and small components
2010
·
Cherie Chen
, Laye Feng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Works count:
29
Citation count:
288
H-index:
9
I10-index:
9
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