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Author

C. Thanner

Observed name: Chr. Thanner
Institution: EV Group (Austria)
OpenAlex ID: A5109341650
Lateral quantization induced emission energy shift of buried GaAs/AlGaAs quantum wires
1990 · B. E. Maile, A. Forchel, et al. · Applied Physics Letters · 33
A simple fabrication process for disposable interdigitated electrode arrays with nanogaps for lab-on-a-chip applications
2017 · S. Partel, S. Kasemann, et al. · Microelectronic Engineering · 25
Selective area growth of GaAs and AlGaAs with TMGa, TMAl, AsH3 and HCl by atmospheric pressure MOVPE
1992 · L. Korte, Chr. Thanner, et al. · Journal of Crystal Growth · 19
Fully automated hot embossing processes utilizing high resolution working stamps
2009 · T. Glinsner, T. Veres, et al. · Microelectronic Engineering · 14
Fully automated hot embossing processes utilizing high resolution working stamps
2010 · T. Glinsner, T. Veres, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 10
Critical dimension uniformity characterization of nanoimprinted trenches for high volume manufacturing qualification
2016 · H. Teyssedre, S. Landis, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Novel surface emitting GaAs/AlGaAs laser diodes based on surface mode emission
1993 · A. Köck, A. Seeberg, et al. · Applied Physics Letters · 5
GaAs/AlGaAs quantum well laser for high-speed applications
1991 · H. Lang, H.D. Wolf, et al. · IEE Proceedings J Optoelectronics · 5
A novel surface emitting GaAs/AlGaAs laser diode beam steering device based on surface mode emission
1994 · A. Köck, C. Gmachl, et al. · Applied Physics Letters · 4
Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow
2017 · H. Teyssedre, S. Landis, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Step and Repeat Imprint Lithography for Wafer Scale Mastering of Micro-and Nanostructures
2022 · C. Thanner, A. Bichler, et al. · CAS proceedings · 2
UV Imprinting Processes for Fabrication of Micro Optical Components
2021 · C. Thanner, J. Peter, et al. · CAS proceedings · 2
Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication
2007 · V. Dragoi, G. Mittendorfer, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
High throughput parallel micro and nano-scale replication - a low cost alternative for the fabrication of electronic-, optic- and microfluidic devices
2012 · G. Kreindl, R. Miller, et al. · IEEE International Conference on Nanotechnology (IEEE-NANO) · 1
III/V Wafer Bonding Technology for Wafer-Level Fabrication of GaInAsP/InP Microring Resonators
2006 · V. Dragoi, G. Mittendorfer, et al. · CAS proceedings · 1
Novel surface-emitting GaAs/AlGaAs laser diode beam steering device based on surface mode emission
1993 · Anton Koeck, Matthias Rosenberger, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Fully automated hot embossing processes utilizing high resolution working stamps
2010 · T. Glinsner, T. Veres, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Selective Area Growth Of GaAs and AlGaAs with TMGa, TMAI, AsH/sub 3/ and HCI by Atmospheric Pressure MOVPE
2005 · L. Korte, C. Thanner · Sixth International Conference Metalorganic Vapor Phase Epitaxy
Surface emitting semiconductor laserdiodes based on surface mode emission
1992 · A. Köck, A. Seeberg, et al. · Microelectronic Engineering
Surface plasmon enhanced light emission in GaAs/AlGaAs light emitting diodes
1991 · Erich Gornik, Anton Koeck, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Works count: 20
Citation count: 132
H-index: 5
I10-index: 5
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